...A. F. Askari Farahani; M. Al-Bassyiouni; A. Dasgupta In this study, the transient response of electronic assemblies to mechanical loading encountered in drop and shock conditions are investigated with transient finite element methods. Many manufacturers face design challenges when evolving new...

... an experimental investigation of the transient response of a portable electronic product and its subassemblies to dynamic mechanical loading encountered in drop and shock conditions. The portable electronic product tested in this study consists of a circuit card assembly and a battery pack supported in a two...

... the overall effectiveness of the TIM. Although significant amount of work has been done on understanding the thermal and moisture effects of various polymer materials used in microelectronic package assemblies, very limited work has been done to study the effect of temperature and moisture on TIM delamination...

... of the package before curing varied depending on the assembly process, but that after curing was almost the same for all the processes studied. It was found that the interconnect reliability is closely related to the differences in the warpage arising from the assembly process, and that the smaller change...

... was to determine if welding of the output-can onto the initiator header could produce stresses in the glass great enough to cause cracking. A finite element analysis solution was chosen to model the transient heat transfer and temperature distribution in the initiator assembly during the welding process...

...Hironori Tohmyoh; Kiichiro Yamanobe; Masumi Saka; Jiro Utsunomiya; Takeshi Nakamura; Yoshikatsu Nakano This paper deals with typical mechanical problems that are encountered in a solderless press-fit assembly process. First, the elastic-plastic properties of two types of press-fit pins...

.... The approach along with the numerical procedures developed for the investigation can be a practical tool for realizing better device reliability and thus high manufacturing yield. 21 02 2007 26 09 2007 09 05 2008 assembling flip-chip devices integrated circuit interconnections...

...Wen-Ren Jong; Hsin-Chun Tsai; Hsiu-Tao Chang; Shu-Hui Peng In this study, the effects of the temperature cyclic loading on three lead-free solder joints of 96.5Sn–3.5Ag, 95.5Sn–3.8Ag-0.7Cu, and 95.5Sn–3.9Ag-0.6Cu bumped wafer level chip scale package (WLCSP) on printed circuit board assemblies...

...Saketh Mahalingam; Kunal Goray; Sandeep Tonapi; Suresh K. Sitaraman No-flow underfill materials reduce assembly processing steps and can potentially be used in fine-pitch flip chip on organic board assemblies. Such no-flow underfills, when filled with nano-scale fillers, can significantly enhance...

... assemblies. Will lead-free solders provide the characteristics necessary to allow the world to depend on it in the future? This paper cannot answer this question; however, it will help all participants in the soldering world better understand what needs to be done in order to answer this question and plan...

...Hai Bo Fan; Edward K. L. Chan; Cell K. Y. Wong; Matthew M. F. Yuen Interfacial failure under thermal cycling conditions is one of the main concerns in package design. To minimize such failure in multi-layered electronic assemblies and packages, it is important to develop a better understanding...

...S. Chaparala; J. M. Pitarresi; S. Parupalli; S. Mandepudi; M. Meilunas One of the primary advantages of surface mount technology (SMT) over through-hole technology is that SMT allows the assembly of components on both sides of the printed circuit board (PCB). Currently, area array components...

...Daijiao Wang; Ronald L. Panton This paper reports the experimental findings of void formation in eutectic and lead-free solder joints of flip-chip assemblies. A previous theory indicated that the formation of voids is determined by the direction of heating. The experiments were designed to examine...

...B. L. Chen; X. Q. Shi; G. Y. Li; K. H. Ang; Jason P. Pickering In this study, a thermoelectric cooler-based rapid temperature cycling (RTC) testing method was established and applied to assess the long term reliability of solder joints in tape ball grid array (TBGA) assembly. This RTC testing...

... behavior under environmental stresses. In this study, the thermo-mechanical durability of the Pb-free Sn3.8Ag0.7Cu solder is investigated by a systematic approach combining comprehensive thermal cycling tests and finite element modeling. A circuit card assembly (CCA) test vehicle was designed to analyze...

...Ahmad Abu Obaid; Jay G. Sloan; Mark A. Lamontia; Antonio Paesano; Subhotosh Khan; John J. Gillespie, Jr. The objective of this work was to experimentally determine the in situ creep behavior and constitutive model equations for a commercial area array package and printed wiring board assembly...

...Srinivasa Aravamudhan; Daryl Santos; Gerald Pham-Van-Diep; Frank Andres Stencil printing is a critical first step in surface mount assembly. However, its robustness can be called into question because of the fact that about 50% or more of the defects found in the assembly of printed circuit boards...

...J. Cepeda-Rizo; Hsien-Yang Yeh; N. Teneketges The paper presents a study on printed wiring board (PWB) warpage caused by the mechanical fastening of separable interconnects, known as land grid array (LGA) package assemblies. Out-of-plane displacement of the PWB were measured and characterized...

...Ismail Fidan The trend to high-density packaging in surface mount assembly has highlighted inherent difficulties in the assembly line of these very fine pitch devices. A variety of defects is still common in printed circuit board assembly (PCBA) technology despite all the improvements made...

... in which the solder volume is small ( Bo ≪ 1 , where Bo is the Bond number), the finite element solution of the axisymmetric solder joint is well approximated by a surface of revolution whose generating meridian is a circular arc. Experimental results of solder joints in flip-chip assembly were found...