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Keywords: bending strength
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Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2023, 145(3): 034502.
Paper No: EP-22-1060
Published Online: February 8, 2023
...M. Y. Tsai; T. C. Kuo This paper aims to demonstrate the biaxial bending strength test on thin silicon dies using the classic ball-on-ring (BoR) test and discuss it in detail by comparing those results with the newly-proposed point load on elastic foundation (PoEF) test. The geometric linear...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031002.
Paper No: EP-20-1125
Published Online: September 15, 2021
...M. Y. Tsai; H. Y. Liu The ball-on-ring (BoR) test, one of the most popular biaxial bending tests, is thoroughly investigated in this study for determining the bending strength of thin silicon dies. The application of this test method with a linear theory to the thin dies is also reevaluated using...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 496–503.
Published Online: August 27, 2007
... for VQFN with Sn–Ag–Cu solder joint under cyclic bending load at both 25°C and 125°C. 23 01 2007 27 08 2007 bending strength copper alloys electronics packaging fatigue testing finite element analysis silver alloys soldering solders stress-strain relations surface finishing tin...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 93–97.
Published Online: March 14, 2003
... mount technology printed circuit accessories printed circuit testing adhesives impact testing impact strength filled polymers conducting polymers shear strength bending strength scanning electron microscopy 04 December 2000 01 May 2002 14 03 2003 2003 ASME ...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 47–51.
Published Online: September 2, 1998
... circuit reliability filled polymers diffusion moisture moulding sorption plasticity Young's modulus tensile strength bending strength Moisture sorption in molding compounds employed in plastic packaging of integrated circuit (IC) devices has been treated by the majority of investigators...