... using a wire thermocouple. A k-type thermocouple was employed to measure the ambient temperature. Calibration experiment setup 23 08 2007 15 04 2008 11 02 2009 ball grid arrays chip scale packaging circuit reliability numerical analysis thermal analysis...

.... This work was supported by the NSFC (No. 50775138) and a research collaboration project between Intel and SJTU. 30 03 2007 10 09 2007 08 05 2008 circuit reliability circuit simulation elastic moduli printed circuit design printed circuit testing solders PCB FE simulation...

... vibrations and occasionally severe drop impacts to the electronic packages within. Reliability of these packages under monotonic or repetitive mechanical loads therefore stands for another indispensable concern. board-level drop test WLCSP reliability JEDEC chip scale packaging circuit...

... circuit reliability failure analysis ball grid arrays surface mount technology reflow soldering printed circuit manufacture wetting thermal stability inspection 19 March 2002 14 03 2003 Contributed by the Electronic and Photonic Packaging Division for publication...

... interconnects. Decreasing the thickness of the chip also increases its flexibility, as illustrated in Fig. 1 . Thinner packages also require new expertise, specifically, in the analysis of stresses and reliability of ultra-thin flip-chip applications. ball grid arrays chip scale packaging circuit...

... testing bending impact testing impact strength adhesives shear strength interconnections circuit reliability scanning electron microscopy failure (mechanical) 04 December 2000 01 May 2002 12 12 2002 Contributed by the Electronic and Photonic Packaging Division...

... Division October 12, 2001. Associate Editor: Y.-H. Pao. 12 October 2001 12 12 2002 soldering lead alloys tin alloys fatigue cracks ageing cooling granular structure crystal microstructure casting packaging fatigue testing circuit reliability As solder joints...

... with ultra-fine pitch technology. flip-chip devices adhesives fine-pitch technology conducting polymers circuit reliability environmental testing contact resistance electric resistance measurement filled polymers 27 July 1999 26 07 2002 Contributed by the Electronic...

... . Manuscript received by the EPPD December 7, 2000. Associate Editor: S. M. Heinrich. 07 December 2000 26 07 2002 fatigue circuit reliability printed circuit manufacture packaging production testing fracture Thin Films Flexible Printed Circuitry (FPC) High Cycle Fatigue...

... 2002 plastic packaging thermal management (packaging) thermal stress cracking circuit reliability soldering An experiment with solder joints of thin plastic packages was carried out. A “byproduct” result of this experiment—a solder failure mechanism—deserves the attention...

... 02 05 2002 creep chip scale packaging soldering printed circuit manufacture circuit reliability tin alloys silver alloys indium The unique physical and mechanical properties of the low-cost tin-lead solders have facilitated printed circuit board (PCB) assembly choices...

... reliability requires a fundamental understanding of the creep behavior of Sn-Pb solders. tin alloys lead alloys soldering creep circuit reliability printed circuits ball grid arrays To verify the validity further, the new creep constitutive model was implemented into the finite element...

... thermal analysis wave soldering printed circuit manufacture stress analysis cooling circuit reliability Integrity of plated through holes (PTHs), as shown in Fig. 1 , has become one of the primary printed wiring board (PWB) reliability concerns either during the component assembly process...

... structures. The bandwidth of the stiffness matrix can be somewhat large in a NFEM mesh because of the nesting scheme. Hence in this study, a reverse Cuthill-Mckee (George et al. 9 ) algorithm is implemented to optimize the bandwidth, and further reduce the computational time. packaging circuit...

... circuit reliability stress analysis failure analysis finite element analysis thermal stress cracking viscoplasticity interconnections The challenging task in today’s fast paced electronics industry is to accurately assess the reliability at a minimal cost and time. Virtual qualification...

... received by the EEPD September 11, 1999; revised manuscript received July 21, 2000. Associate Editor: R. Wirtz. 11 September 1999 21 July 2000 thermal management (packaging) plastic packaging forced convection thermal resistance circuit reliability Forced Convection...

... mechanics circuit reliability printed circuits plastic deformation thermal stress cracking crack-edge stress field analysis delamination soldering finite element analysis The last decade witnessed an explosive growth in the research and development efforts devoted to solder bumped flip chips...

... 15 May 2000 plastic packaging flip-chip devices micromechanics circuit reliability shear deformation thermal stresses light interferometry Surface Laminar Circuit Flip Chip Underfill Microscopic Moire´ Interferometry Photosensitive Dielectric Layer Solder Resist Mask Metal...

... higher density of input-output connection per chip area, it also offers a socketable packaging solution: something which cannot be achieved by its plastic ball grid array counterparts. Flip Chip Deformation Thermal and Mechanical Loading plastic packaging circuit reliability flip-chip...

... multichip modules circuit reliability finite element analysis circuit layout CAD 2000 ASME ...