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Keywords: condition monitoring
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021007.
Paper No: EP-12-1096
Published Online: March 28, 2013
.... [3] International Technology Roadmap for Semiconductors (ITRS) , 2009 , http://www.itrs.net/home.html [4] Yang , S. , Xiang , D. , Bryant , A. , Mawby , P. , Ran , L. , and Tavner , P. , 2010 , “ Condition Monitoring for Device Reliability in Power Electronic...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011008.
Published Online: February 4, 2008
..., durability increases as void size increases from 1% to 15% and then decreases for voids bigger than 15%. 01 02 2007 29 08 2007 04 02 2008 condition monitoring continuum mechanics couplings creep durability failure analysis fatigue finite element analysis flaw detection...
