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Keywords: conductive adhesives
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031006.
Paper No: EP-17-1110
Published Online: June 11, 2018
... in conducting heat to the heatsink [ 4 – 6 ]. Composite materials Conductive adhesives Harsh environment Nanotechnolgy Reliability Thermal analysis 15 10 2017 09 04 2018 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031009.
Paper No: EP-17-1012
Published Online: July 14, 2017
... manuscript received May 31, 2017; published online July 14, 2017. Assoc. Editor: Xiulin Ruan. 30 01 2017 31 05 2017 Area array BGA Conductive adhesives Conductive Inks Conformal coatings Electronic Flip chip High density interconnects Microsystems PWB Rework SMT Underfill...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011004.
Paper No: EP-16-1075
Published Online: December 29, 2016
... is unlimited. 24 06 2016 04 11 2016 Composite materials Conductive adhesives Microsystems Solder Thermal analysis The performance characteristics of TIMs continue to improve rapidly with the development of novel nanostructured materials and advanced manufacturing processes...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 020804.
Paper No: EP-16-1006
Published Online: April 21, 2016
... Progresses on Hybrid Micro–Nano Filler Systems for Electrically Conductive Adhesives (ECAs) Applications ,” J. Mater. Sci. Mater. Electron. , 26 ( 7 ), pp. 4730 – 4745 . 10.1007/s10854-015-3016-1 [48] Applied Nanoparticle Laboratory and Toyota Motor , 2013 , “ Three-Metallic-Component Type...
Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2015, 137(4): 040803.
Paper No: EP-15-1063
Published Online: October 9, 2015
... in the heat transfer direction. The approach is different than Raytheon's as it has no interposer. GT applied extensive measurement capability to their effort, includes the use of infrared microscopy for thermal resistance measurements [ 14 ]. Thermally conductive adhesives are used as the attachment material...
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Journal Articles
Journal Articles