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Keywords: cutting
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2008, 130(2): 024501.
Published Online: May 8, 2008
...Raathai Molian; Pranav Shrotriya; Pal Molian The traditional “evaporation∕melt and blow” mechanism of C O 2 laser cutting of aluminum nitride (AlN) chip carriers and heat sinks suffers from energy losses due to its high thermal conductivity, formation of dross, decomposition to aluminum...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 254–259.
Published Online: August 30, 2000
... has also been employed to slice other brittle materials such as alumina, quartz, glass, and ceramics. The manufacturing process of wiresaw is a free abrasive machining (FAM) process. Specifically, the wiresaw cuts brittle materials through the “rolling-indenting” and “scratch-indenting” processes...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 34–41.
Published Online: July 6, 2000
...C. F. Cheung; W. B. Lee; W. M. Chiu Dam-bar cutting is an essential trimming process in which the dam-bars in between the leads of Integrated Circuit (IC) packages are removed after encapsulation and deflashing. There are stringent requirements imposed on the quality of the sheared dam-bar edges so...