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Keywords: damage initiation
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011008.
Published Online: February 4, 2008
...Leila Jannesari Ladani; Abhijit Dasgupta This study examines damage initiation and propagation in solder joints with voids, under thermomechanical cyclic loading. An accelerated thermal cycling test is conducted on printed wiring assemblies (PWAs) containing 256 input/output (I/O) plastic ball grid...
