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Keywords: durability
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011016.
Published Online: February 25, 2009
...Y. Zhou; M. Al-Bassyiouni; A. Dasgupta In this paper, the vibration durability of both SAC305 and Sn37Pb interconnects are investigated with narrow-band harmonic vibration tests conducted at the first natural frequency of the test, printed wiring board, using constant-amplitude excitation. A time...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011008.
Published Online: February 4, 2008
... described above is then used for parametric study of the durability of voided solder balls in a ChipArray Thin Core BGA with 132 I/O (CTBGA132) assemblies, under thermal cycling. The critical solder ball in the package is selected and is error seeded with voids with different sizes and various distances...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 273–277.
Published Online: September 8, 2006
...Leila Jannesari Ladani; Abhijit Dasgupta The effect of process-induced voids on the durability of Sn–Pb and Pb-free solder interconnects in electronic products is not clearly understood. Experimental studies have provided conflicting ambiguous conclusions, showing that voids may sometimes...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 512–522.
Published Online: May 3, 2005
...Qian Zhang; Abhijit Dasgupta; Peter Haswell This study is motivated by the urgent need in the electronics industry for mechanical properties and durability of Pb-free solders because the use of Pb will be banned in the EU by July 1, 2006. The isothermal mechanical durability of three NEMI...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 415–429.
Published Online: January 6, 2005
... using the Pb-free solders. There are extensive databases of mechanical properties, durability properties (for both mechanical and thermal cycling), and micromechanical characteristics for Sn-Pb solders. But similar databases are not readily yet available for Pb-free solders to predict its mechanical...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 26–33.
Published Online: April 30, 2004
... materials have the required mechanical properties and durability and can be conveyor manufactured in any size and shape, including continuous flexible multi-strand round wire and electronics. Rosner , C. H. , 1998 , “ Emerging 21st Century Markets and Outlook for Applied Superconducting Products...