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Keywords: electronic package
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031007.
Paper No: EP-13-1074
Published Online: May 12, 2014
... Tonapi. 22 07 2013 11 04 2014 Electronic packaged devices are becoming increasingly smaller in size and higher in density while requiring higher performance and superior reliability. Warpage is one of the crucial factors for the thermomechanical reliability of electronic packages...
Journal Articles