... measurement methods, and published data. References [1] Wong , E. H. , Koh , S. W. , Rajoo , R. , and Lim , T. B. , 2000 , “ Underfill Swelling and Temperature-Humidity Performance of Flip Chip PBGA Package ,” Proceedings of Third Electronics Packaging Technology Conference (EPTC...

...Liu Chu; Jiajia Shi; Eduardo Souza de Cursi Ball grid arrays (BGAs) offer significant advantages in the automotive industry, such as their small size and high integration density, making them a promising electronic packaging approach. However, the operating environment of automobiles is more...

...Tongju Wang; Yahao Liu; Wenqian Zhang; Yongping Lei; Jian Lin; Hanguang Fu; Zipeng Lin Solder balls used in electronic packaging should have high dimensional and shape accuracy requirements to ensure the connection quality of solder balls during soldering. However, the existing solder ball...

...@usm.my 13 09 2021 25 10 2021 01 12 2021 bump pitch design optimization electronic packaging flip-chip gap height underfill encapsulation Rapid technological advancements drive the micro-electronics sector to focus on both miniaturization and performance aspects...

....2014.03.012 [8] Lee , S. , Yim , M. J. , Master , R. N. , Wong , C. P. , and Baldwin , D. F. , 2008 , “ Void Formation Study of Flip Chip in Package Using No-Flow Underfill ,” IEEE Trans. Electron. Packag. Manuf. , 31 ( 4 ), pp. 297 – 305 . 10.1109/TEPM...

... rapid prototyping electronic packaging The die-bonding process was carried out by means of a micro-assembly station (Fineplacer lambda, Finetech GmbH). The die was picked by the mechanical arm of the machine and positioned precisely above the designated area on the interposer. An anisotropic...

..., 2019; published online May 24, 2019. Assoc. Editor: Toru Ikeda. 21 08 2018 22 04 2019 3DPC ceramic substrate aluminosilicate cement shear strength electronic packaging thermal reliability Currently, ceramic substrate has drawn considerable attention in power electronics...

... solid-state bonding electronic packaging Si chip Cu substrate At present, nearly all large-scale integrated circuit chips are packaged with flip-chip interconnect technology. The chip is flipped over and the active (front) side is connected to the package using numerous tiny solder joints...

... interconnect solid-state bonding electronic packaging Si chips Cu substrates At present, nearly all large-scale integrated circuit (IC) chips are packaged with flip-chip technology. This means that the chip is flipped over and the active (front) side is connected to the package using a large number...

...) are able to correspond to profiles found in XRD database, showing that 304SS has face-centered cubic crystal lattice. The Ni strike technique is used as surface treatment to make 304SS bondable to other metals, such as silver (Ag), copper (Cu), and gold (Au), commonly used in electronic packaging. Cross...

... bonding solid-state bonding process electronic packaging integrated circuits In the flip-chip technology, interconnects are made from the active (front) surface of chips to package substrates. The interconnect joints provide mechanical support, electrical connections, and heat conduction...

...Rohit Dev Gupta; Vinayak Eswaran Compact thermal models (CTMs) are simplified multi-nodal thermal resistor network representations of the detailed material and geometric structure of the electronic package. CTMs predict the thermal response of the package, in various environments, to within...

... of molding compound above the joint, which increased the package compliance. FEA of the electronic packaging assembly is performed with fatigue crack length prediction (and thus package reliability) as the ultimate goal. A FEA model was built to predict the TMF of the BGA assembly. The model geometry...

... . Cotterell , B. , Chen , Z. , Han , J. B. , and Tan , N. X. , 2003 , “ The Strength of the Silicon Die in Flip-Chip Assemblies ,” ASME J. Electron. Packag. 1043-7398 10.1115/1.1535934 , 125 , pp. 114 – 119 . McLellan , N. , Fan , N. , Liu , S. , Lau , K...

... the modulus of the interconnection materials, reducing the span of the PCB, or using either a very thin or a very thick PCB. 05 11 2004 30 03 2005 impact testing printed circuit testing stress-strain relations reliability electronic packaging drop impact finite element parametric...

... and effectively modeled using the standard implicit time-integration code. 10 05 2004 17 07 2004 printed circuit manufacture electronics packaging bending finite element analysis heat transfer Electronic Packaging Drop Impact Dynamics Finite Element There has been increasing...

... deformation soldering Electronic Packaging Ball Grid Array (BGA) Solder Joints Low Cycle Fatigue Mixed-Mode Loading Since modern electronics technology requires complex, high density, and high-speed devices, the use of surface mount components has been increased. Due to the high degree...