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Keywords: equivalent modelClose
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 179–189.
Published Online: July 5, 2006
... analysis, a local critical solder–joint analysis, and a fatigue life analysis. The global deformation analysis includes a new optimization formulation for determining an equivalent model. The methodology developed was applied to fine pitch ball grid array (fpBGA) and super ball grid array (SBGA) packages...