..., durability increases as void size increases from 1% to 15% and then decreases for voids bigger than 15%. 01 02 2007 29 08 2007 04 02 2008 condition monitoring continuum mechanics couplings creep durability failure analysis fatigue finite element analysis flaw detection...

... ultrasonic materials testing flaw detection thermal stress cracking voids (solid) acoustic tomography Ceramic substrates play an extremely important role in electronic packages. Low temperature cofired ceramic (LTCC) technology has the ability to integrate passive components such as capacitors...