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Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 179–189.
Published Online: July 5, 2006
...T. Zhang; S. Rahman; K. K. Choi; K. Cho; P. Baker; M. Shakil; D. Heitkamp This paper presents a global–local methodology for predicting mechanical deformation and fatigue durability of solder joints in electronic packaging systems subject to cyclic thermal loading. It involves a global deformation...