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Journal Articles

A Global–Local Approach for Mechanical Deformation and Fatigue Durability of Microelectronic Packaging Systems

T. Zhang, S. Rahman, K. K. Choi, K. Cho, P. Baker, M. Shakil, D. Heitkamp
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 179–189.
https://doi.org/10.1115/1.2721092
Published Online: July 5, 2006
...T. Zhang; S. Rahman; K. K. Choi; K. Cho; P. Baker; M. Shakil; D. Heitkamp This paper presents a global–local methodology for predicting mechanical deformation and fatigue durability of solder joints in electronic packaging systems subject to cyclic thermal loading. It involves a global deformation...
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Topics: Deformation, Durability, Fatigue, Fatigue cracks, Fatigue life, Solder joints, Solders, Cycles, Fracture (Materials), Stress