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Journal Articles

Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films

Ian Chin, Wei Keat Loh, Seow Chien Kee, Yi He, Mohd. Zulkifly Abdullah, Masahiro Tsuriya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011009.
Paper No: EP-23-1055
https://doi.org/10.1115/1.4066083
Published Online: August 24, 2024
...Ian Chin; Wei Keat Loh; Seow Chien Kee; Yi He; Mohd. Zulkifly Abdullah; Masahiro Tsuriya In this study, high-temperature hygroscopic swelling characterization of different epoxy mold compounds (EMCs) and dielectric build-up films (DBFs) were analyzed using an experimental technique. The approach...
View Article titled, Experimental Method to Measure High-Temperature <span class="search-highlight">Hygroscopic</span> <span class="search-highlight">Swelling</span> in Epoxy Mold Compounds and Dielectric Build-Up Films
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Topics: Absorption, Epoxy resins, High temperature, Temperature, Thermal expansion