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Keywords: large scale integration
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 420–425.
Published Online: September 17, 2003
...Takehiro Saitoh; Hidehito Matsuyama; Masayuki Toya Using Kr 85 radioactive tracer techniques, initial sites of edge delaminations occurring during temperature cyclic tests in large-scale integrated circuit (LSI) plastic packages with either Cu alloy or alloy 42 leadframes are experimentally...
