... With Rare Earth Element Additions ,” Mater. Sci. Eng. R. , 44 ( 1 ), pp. 1 – 44 . 0927-796X 20 11 2007 13 11 2008 01 04 2009 copper compounds electronics packaging fine-pitch technology laser beam applications nickel compounds silver compounds soldering tin compounds...

... accuracy at a relatively low cost. laser ultrasound flip chip solder bump local temporal coherence lead-free laser vibrometer chip scale packaging electronics packaging flip-chip devices laser beam applications light interferometry solders thermoelasticity ultrasonic applications...

... production planning manufacturing processes assembling soldering surface mount technology fine-pitch technology printed circuit manufacture integrated circuit reliability laser beam applications 01 March 2003 30 04 2004 Contributed by the Electronic and Photonic Packaging Division...

... . Manuscript received April 2003; final revision, November 2003. Associate Editor: B. Courtois. 01 April 2003 01 November 2003 30 04 2004 glass ceramics microcracks thermal shock bending fracture internal stresses thermal analysis laser beam applications High quality...