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Keywords: laser materials processing
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031006.
Published Online: June 23, 2009
.... 02 12 2008 22 04 2009 23 06 2009 failure analysis laser materials processing system-in-package One of the major trends in electronic packaging is 3D integration. 3D integrated system-in packages (SiPs) are smaller, lighter, and thinner, and have improved interchip signals...
Journal Articles
K.-F. Becker, T. Braun, A. Neumann, A. Ostmann, E. Coko, M. Koch, V. Bader, R. Aschenbrenner, H. Reichl
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 1–6.
Published Online: March 21, 2005
... metallisation flip-chip devices integrated circuit reliability laser materials processing integrated circuit packaging Wafer Level Packaging System in Package Encapsulation Metallization Laser Structuring Duromer MID Having a closer look at the smallest microelectronics packages, CSPs...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 317–322.
Published Online: August 9, 1999
... separation laser materials processing High quality separation of wafers into chips is important to the electronic industry. Since chips often operate at a high power level (Bar-Cohen 1 , Suhir 2 ) wafers with high quality edges are required. Most of the defects, e.g., microcracks, dislocations...