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Keywords: laser materials processing
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031006.
Published Online: June 23, 2009
.... 02 12 2008 22 04 2009 23 06 2009 failure analysis laser materials processing system-in-package One of the major trends in electronic packaging is 3D integration. 3D integrated system-in packages (SiPs) are smaller, lighter, and thinner, and have improved interchip signals...
Topics: Lasers, Silicon
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 317–322.
Published Online: August 9, 1999
... separation laser materials processing High quality separation of wafers into chips is important to the electronic industry. Since chips often operate at a high power level (Bar-Cohen 1 , Suhir 2 ) wafers with high quality edges are required. Most of the defects, e.g., microcracks, dislocations...