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Journal Articles

Boiling of Water at Subatmospheric Conditions With Enhanced Structures: Effect of Liquid Fill Volume

Aniruddha Pal, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011010.
https://doi.org/10.1115/1.2837523
Published Online: February 12, 2008
... pressure boiling from a plain surface at similar liquid-fill levels. boiling cooling evaporation thermal management (packaging) boiling enhanced structures subatmospheric pressure liquid fill volume fill ratio thermosyphon electronic cooling Liquid cooling is a potentially...
View Article titled, Boiling of Water at Subatmospheric Conditions With Enhanced Structures: Effect of <span class="search-highlight">Liquid</span> <span class="search-highlight">Fill</span> <span class="search-highlight">Volume</span>
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Topics: Boiling, Pressure