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Keywords: micromechanical devices
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031011.
Published Online: September 26, 2011
... microchannel flow micromechanical devices surface chemistry Micropost-filled reactors are commonly found in many micro-total analysis system applications because of their large surface area for the surrounding volume. Optimal fabrication of such devices by increasing the arrays of posts with smaller...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031002.
Published Online: September 8, 2010
... ) of the conventional TEC as a function of r o c 05 11 2009 20 04 2010 08 09 2010 bismuth compounds contact resistance cooling Ge-Si alloys heat transfer microfluidics micromechanical devices Peltier effect refrigeration refrigerators semiconductor device models...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041001.
Published Online: October 16, 2009
.... 16 02 2008 06 04 2009 16 10 2009 damping desorption electronics packaging leak detection life testing micromechanical devices pressure sensors vacuum techniques vacuum packaging molecular flow leak rate MEMS packaging Much research on vacuum packaging...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2009, 131(2): 024502.
Published Online: April 2, 2009
... pipes heat transfer micromechanical devices micro heat pipe mathematical modeling vapor dynamics capillary limit vapor continuum Micro heat pipe is a small-scale device that efficiently transfers thermal energy to heat sink taking advantage of phase change phenomena. The concept...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031002.
Published Online: July 29, 2008
... or intensity, we show that a poor design of the PCB or the MEMS package may result in severe amplification of the shock effect. This amplification can cause early pull-in instability for MEMS devices employing electrostatic forces. 09 01 2007 14 01 2008 29 07 2008 micromechanical devices...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021005.
Published Online: April 25, 2008
... , respectively, which results in higher assembly yield of up to 100% for these samples. 04 07 2007 03 10 2007 25 04 2008 fluidics lubricants micromechanical devices monolayers self-assembly substrates fluidic self-assembly (FSA) self-assembled monolayer (SAM) micropart...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 25–28.
Published Online: March 21, 2005
... packaging micromechanical devices optical fibre couplers internal stresses coupled mode analysis optical fibre losses finite element analysis micro-optics The increasing demands for miniaturization, high electrical performance, and high input/output (I/O) pin count have led significant...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 38–42.
Published Online: March 21, 2005
... many clinical DNA replications with nano-liter quantities of sample/reagent and hence is highly desirable. PCR Microchip Array Polymer Bonding DNA Amplification silicon conducting polymers micromechanical devices micromachining adhesive bonding fluorescence Raman spectra chip...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 48–51.
Published Online: April 30, 2004
... devices micromechanical devices finite element analysis bonding processes assembling micromachining 01 July 2003 30 04 2004 Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received July 2003...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. December 2003, 125(4): 465.
Published Online: December 15, 2003
...L. J. Ernst, Guest Editor; G. Q. Zhang, Guest Editor 15 12 2003 thermal management (packaging) digital simulation optimisation micromechanical devices failure analysis This special issue includes selected papers presented at the International Conference of Thermal...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 4–17.
Published Online: March 14, 2003
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD September 1, 2000, Associate Editor: B. Michel. 01 September 2000 14 03 2003 piezoelectric devices piezoelectric thin films micromechanical devices finite element analysis stress analysis stress-strain relations...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 411–418.
Published Online: December 12, 2002
... 12 12 2002 micromechanical devices probes integrated circuit testing production testing fine-pitch technology contact resistance integrated circuit interconnections With the continued reduction in feature size and with the increased demand for better performance and lower cost...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section On Therminic
J. Electron. Packag. December 2001, 123(4): 321–322.
Published Online: December 1, 2001
...). integrated circuit packaging micromechanical devices integrated circuit modelling thermal management (packaging) ...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 356.
Published Online: December 1, 2000
...E. Suhir,, Editor reliability packaging integrated circuit technology integrated optics micromechanical devices micro-optics Knowledge at the intersection of reliability, mechanical, materials, chemical, electrical, optical, manufacturing and software engineering holds the key...