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Keywords: nondestructive testing
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021007.
Published Online: June 23, 2011
... )]. These 3D images therefore strongly suggest that a number of microcracks were formed by sliding along the phase boundaries and then connected to the main crack. Such visual information has not been obtained at all by X-ray CT systems for industrial use and shows the effectiveness of nondestructive testing...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 434–439.
Published Online: May 2, 2007
.... The development of nondestructive testing methods with high spatial resolution is expected to enhance reliability. An X-ray microtomography system called SP - μ CT has been developed in Super Photon ring-8 GeV (SPring-8), the largest synchrotron radiation facility in Japan. In this work, SP - μ CT was applied...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 225–231.
Published Online: July 8, 2004
... leading to fracture and failure, and cyclic mechanical and thermal loading including rate, dwell time, and amplitude. solders failure (mechanical) finite element analysis nondestructive testing CCD image sensors electronics packaging 01 May 2003 01 January 2004 08 07 2004...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 345–351.
Published Online: December 12, 2002
... displacement measurement atomic force microscopy integrated circuit reliability nondestructive testing correlation methods flip-chip devices image processing crack detection Quality and suitability of thermo-mechanical design and optimization of advanced electronic packages by means of finite...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 352–354.
Published Online: December 12, 2002
... and presented at Poly 2000, London, United Kingdom, December 4–5, 2000. Manuscript received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 shrinkage adhesives nondestructive testing Light-based systems are able to deliver...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 340–344.
Published Online: December 12, 2002
.... Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 internal stresses laminates light interferometry moire fringes nondestructive testing stress analysis The subject of residual stress due to coefficient of thermal expansion (CTE) mismatch between...