... extensively in high-density electronics such as (PDA), mobile phone, (LCD), smart cards, and disk drives 2 . ACF Bumpless Reflow Reliability silicon conducting polymers polymer films aluminium chip scale packaging integrated circuit bonding reflow soldering adhesives adhesive...

...V. Gonda; J. den Toonder; J. Beijer; G. Q. Zhang; L. J. Ernst The thermo-mechanical integration of polymer films requires a precise knowledge of material properties. Nanoindentation is a widely used testing method for the determination of material properties of thin films such as Young’s modulus...

...-of-the-art of thermo-mechanical thin film characterization methods, such as the substrate curvature test, nanoindentation technique, bulge test, and impulsive stimulated thermal scattering. 24 02 2004 22 12 2004 thermal management (packaging) polymer films thermomechanical treatment...

... 2001, pp. 70–2. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received April 2004. Associate Editor: Y. C. Lee. 01 April 2004 06 10 2004 ageing polymer films dielectric thin films...

.... In a more general sense, this opens the perspective of using nanoindentation in combination with numerical modeling as a promising material characterization technique for thin polymer films. Another important issue currently under study is the influence of temperature. In this case, indentation...

... 2002 12 12 2002 encapsulation flip-chip devices chip-on-board packaging integrated circuit packaging plastic packaging polymer films heat treatment differential scanning calorimetry The reliability of flip chip on board (FCOB) samples is greatly increased by the introduction...

... for copper damascene patterning and a KH phthalate-based model slurry developed for SiLK. Blanket polymer films were polished in order to determine the interactions that occur when copper and liner materials are removed by the damascene CMP process. Removal rates were obtained from material thickness...

.... Associate Editor: S. M. Heinrich. 19 October 2000 26 07 2002 polymer films stress relaxation viscoelasticity bending internal stresses plastic packaging Damage Accumulation Residual Stress Relaxation Threshold Activation Energy Elastic Potential Polymer Film Radius...

... manuscript received by the EEPD March 10, 2000. Associate Editor: R. Schmidt. polymer films polymer structure thermal conductivity plastic packaging optical microscopy thermal conductivity measurement Polyimides are advanced materials which have good high temperature stability, excellent...