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Keywords: re-distribution layer
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011103.
Paper No: EP-22-1013
Published Online: October 22, 2022
... useful reference for the future practice of forming solder joints on sintered nano-Ag pads. 16 03 2022 27 09 2022 22 10 2022 additive manufacturing re-distribution layer solderability reliability Innovation and Technology Commission 10.13039/501100007156 ITS/006/18...