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Keywords: seals (stoppers)
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Journal Articles

Thermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals

Luke M. Thompson, Michael R. Maughan, Karl K. Rink, Donald M. Blackketter, Robert R. Stephens
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 300–306.
https://doi.org/10.1115/1.2753920
Published Online: November 29, 2006
.... Furthermore, if the surface of the initiator cools faster than the center, cracking is more likely. Basic elements of a bridge-wire initiator 24 05 2006 29 11 2006 cooling finite element analysis glass seals (stoppers) thermal management (packaging) thermal stress cracking...
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Topics: Finite element analysis, Glass, Stress, Wire, Manufacturing, Bridges (Structures), Cooling, Temperature
Journal Articles

Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch

J. Lau, Fellow ASME, Z. Mei, S. Pang, C. Amsden, J. Rayner, S. Pan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 403–410.
https://doi.org/10.1115/1.1512294
Published Online: December 12, 2002
.... Associate Editor: E. Suhir. 06 August 2002 12 12 2002 photonic switching systems soldering seals (stoppers) thermal analysis materials handling creep stress analysis finite element analysis fatigue testing tin alloys indium alloys thermal stress cracking packaging...
View Article titled, Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch
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Topics: Creep, Fatigue, Fatigue testing, Sealing (Process), Solders, Stress, Switches, Density, Cycles, Finite element analysis