...Ming Kong; Sungeun Jeon; Chiwon Hwang; Y. C. Lee Solder self-alignment is an important phenomenon enabling cost-effective optoelectronics assembly. In this study, the wetting of Sn-rich solder to under bump metallization (UBM) pads is identified as a critical factor affecting self-alignment...

... developed in which underfill is dispensed prior to chip placement or directly on the wafer and solder reflow and underfill cure occur simultaneously. This reduces the cycle time required for manufacturing. However, the presence of the underfill can affect the flip chips’ capacity for self-alignment. Self...

...Wei Zhang; Chunqing Wang; Yanhong Tian Fiber attachment soldering is low cost and high-precision technology in direct-coupling optoelectronic packaging. For accurate alignment, it is crucial to understand the self-alignment behavior of solder joint. In this research, the self-alignment method...