... in the model. The multiple transistors on the silicon chip are modeled by superimposing the results from the finite element analysis. 14 09 2010 23 08 2011 23 12 2011 23 12 2011 elemental semiconductors finite element analysis microprocessor chips semiconductor device models...

... ) of the conventional TEC as a function of r o c 05 11 2009 20 04 2010 08 09 2010 bismuth compounds contact resistance cooling Ge-Si alloys heat transfer microfluidics micromechanical devices Peltier effect refrigeration refrigerators semiconductor device models...

... different from the experimental results. Several needed improvements to the electron-mobility model are proposed in this article. 06 04 2009 26 09 2009 04 03 2010 04 03 2010 conduction bands electron mobility internal stresses MOSFET moulding semiconductor device models...

... 2008 17 09 2009 21 10 2009 cooling finite element analysis heterojunction bipolar transistors microwave power amplifiers power bipolar transistors semiconductor device models temperature distribution collector-up (C-up) finite-element model (FEM) heterojunction bipolar...