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Keywords: solder alloy
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Journal Articles
Rilwan Kayode Apalowo, Mohamad Aizat Abas, Muhamed Abdul Fatah Muhamed Mukhtar, Mohamad Riduwan Ramli
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011005.
Paper No: EP-24-1049
Published Online: July 16, 2024
...Rilwan Kayode Apalowo; Mohamad Aizat Abas; Muhamed Abdul Fatah Muhamed Mukhtar; Mohamad Riduwan Ramli This study investigated the thermal fatigue reliability of ball grid array (BGA) solder joints under accelerated thermal cycling, considering the impacts of solder alloy and temperature profile...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 41–47.
Published Online: May 18, 2006
...Xianjie Yang; Yan Luo; Qing Gao Based on the time dependent multiaxial deformation behavior of 96.5 Sn - 3.5 Ag solder alloy, a constitutive model is proposed which considers the nonproportional multiaxial cyclic deformation properties. In the back stress evolution equations of this model...