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Keywords: surface mount technology
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011011.
Paper No: EP-21-1002
Published Online: August 6, 2021
..., the data obtained showed to be in good agreement and it was concluded that the force exerted by the solder wave is approximately 0.02 N. e-mail:  violeta.carvalho@dem.uminho.pt 06 01 2021 19 04 2021 06 08 2021 computational fluid dynamics wave soldering surface mount...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011012.
Published Online: February 13, 2009
... analysis reliability surface mount technology system-in-package Multilayer ceramic chip capacitors are often used as integrated passives in, e.g., system in package (SIP) applications due to their small size but large capacitance. For these applications, the capacitors have to go through...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031009.
Published Online: August 1, 2008
... modal analysis soldering solders surface mount technology Today’s electronic devices are compact, miniature, and high density, and surface mount technology is used extensively to mount these electronic products. The use of surface mount devices (SMDs), such as the flip chip packages (FCPs...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 149–156.
Published Online: August 14, 2006
... in providing the interconnection for surface mount technology (SMT) passives and leaded, bumped, or bumpless integrated circuit packages. The requirement for precise stencil printing was eliminated, as the application of magnetic field aligned the conductive columns in the Z -axis direction eliminating any...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 441–448.
Published Online: February 23, 2006
...S. Chaparala; J. M. Pitarresi; S. Parupalli; S. Mandepudi; M. Meilunas One of the primary advantages of surface mount technology (SMT) over through-hole technology is that SMT allows the assembly of components on both sides of the printed circuit board (PCB). Currently, area array components...
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 546–553.
Published Online: January 24, 2005
... October 8, 2003; revision received June 14, 2004. Review conducted by: Z. Suo. 08 October 2003 14 June 2004 24 01 2005 thermal management (packaging) chip scale packaging natural convection thermal analysis laminar flow coolants water numerical analysis surface mount...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 415–429.
Published Online: January 6, 2005
... viscoplasticity printed circuit testing surface mount technology finite element analysis Solder materials are extensively used as interconnects in packaging technologies. In surface mount technologies the solder interconnect is required to act as not only an electronic and logical path but also...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 340–352.
Published Online: December 10, 2004
... manufacture surface mount technology ball grid arrays flip-chip devices Stencil Printing Fine Feature Solder Paste Release Efficiency The need for more reliable, lighter, and smaller products have increased the use of flip chips (FCs), chip scale packages (CSPs), micro-BGAs ( μ BGA...
Topics: Printing, Solders
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2004, 126(1): 173–176.
Published Online: April 30, 2004
... ), pp. 71 – 78 . Primavera , A. A. , 2000 , “ The Influence of PCB Parameters on Assembly and Reliability ,” Advanced Packaging , pp. 29 – 52 . Prasad, R. P., 1997, Surface Mount Technology: Principles and Practice , Chapman & Hall. Haslehurst , L. , and Ekere , N. N...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2003, 125(4): 621–624.
Published Online: December 15, 2003
... technology integrated circuit packaging finite element analysis There are two major methods to perform lead finishing on the leaded SMT (surface mount technology) components, namely, the pre-plated finishes (PPF) and the post-molded finishes (PMF). For PPF, the solderable lead finishes...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 335–346.
Published Online: September 17, 2003
...A. Tava´rez; J. E. Gonza´lez The development of a mathematical model of the soldering process of actual pastes as used in surface mount technology (SMT) lines is described in this paper. The coupled heat transfer processes between the solder paste and the flux including changes in solder paste...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 426–430.
Published Online: September 17, 2003
... concern in the electronic packaging industry since the introduction of surface mount technology (SMT). Microstructural coarsening (phase growth) is considered to be closely related to thermomechanical fatigue failure. Many researchers proposed coarsening models for bulk scale metals. But these models have...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 157–161.
Published Online: March 14, 2003
... 14 03 2003 plastic packaging assembling circuit reliability failure analysis ball grid arrays surface mount technology reflow soldering printed circuit manufacture wetting thermal stability inspection Defect PBGA Assembly Soldering Profile Surface Mount Technology...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 93–97.
Published Online: March 14, 2003
... received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 14 03 2003 surface mount technology printed circuit accessories printed circuit testing adhesives impact testing impact strength filled polymers conducting polymers shear...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 374–378.
Published Online: December 12, 2002
... Contributed by the Electronic and Photonic Packaging Division and presented at Poly 2000, London, United Kingdom, December 4–5, 2000. Manuscript received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 surface mount technology...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 367–370.
Published Online: December 12, 2002
... mount technology printed circuit manufacture Taguchi methods design of experiments mechanical properties conducting polymers In order to identify the desirable formulation and the preferred material parameters of the electrically conductive adhesives under investigation, the design...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2001, 123(2): 101–104.
Published Online: June 1, 2001
... connection and to achieve reliable thermal fatigue life. surface mount technology integrated circuit packaging plastic packaging viscoelasticity elastic moduli shear modulus elastic deformation finite element analysis Contributed by the Electrical and Electronic Packaging Division...