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Keywords: temperature
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021003.
Paper No: EP-20-1042
Published Online: August 27, 2020
... demonstrated with newly developed flexible hybrid electronics products. e-mail:  om.yadav@ndsu.edu 03 02 2020 28 07 2020 27 08 2020 flexible hybrid electronics cumulative damage degradation temperature humidity lifetime distribution stress factors reliability...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021004.
Paper No: EP-18-1042
Published Online: February 4, 2020
...Zuozhu Yin; Fenglian Sun; Mengjiao Guo In electronic packaging, most researchers are mainly focused on the mechanical properties of Cu–Sn intermetallic compounds (IMCs) at room temperature; few studies have looked into the relationship between hardness, elastic modulus, and plasticity of IMCs...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 273–280.
Published Online: September 20, 2005
... sinks laminar flow heat transfer constructal theory constructal network loops complexity temperature Heat sinks incorporating microchannels, introduced by Tuckerman and Pease ( 1 ), are an attractive design option which increases the convective heat transfer coefficient, as well...