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Keywords: thermal aging
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021004.
Paper No: EP-22-1026
Published Online: November 10, 2023
... events for a ball-grid array package on printed circuit board assembly to calculate hysteresis loop and plastic work density. The plastic work per shock event measures the damage progression of the solder interconnects. Thermal aging effects have been studied in terms of the hysteresis loop...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021005.
Paper No: EP-20-1080
Published Online: October 8, 2020
... of Anand parameters for unaged and aged SAC (SAC105 and SAC-Q) lead-free solder alloys at high strain rates has been investigated induced under sustained periods of thermal aging. The thermal aged lead-free SAC solder alloys specimen has been tested at high strain rates (10–75 per sec) at elevated...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 149–156.
Published Online: August 14, 2006
... lateral conductivity. The ability to mass cure the adhesive while applying the magnetic field reduced the assembly time considerably. Placement accuracy was still found to be very critical. Shear testing of adhesive joints after thermal aging showed significance past 500 h and after temperature–humidity...