... electronics packaging fatigue testing flip-chip devices life testing nanostructured materials passivation reliability silicon compounds thermal shock thermomechanical treatment Underfill materials are used in flip chip assemblies to enhance the thermomechanical reliability of the solder bumps...

... integrated circuit packaging integrated circuit reliability light interferometry plastic packaging thermal expansion thermomechanical treatment power cycling accelerated thermal cycling Moiré interferometry flip chip PBGA CBGA finite element analysis computational fluid dynamics...

... solders thermomechanical treatment voids (solid) Pb-free solder voids thermo-mechanical durability simulation energy partitioning successive initiation damage initiation damage propagation Voids originating during the manufacturing process can be divided into the following...

... interconnections indentation hardness hardness testing viscoelasticity thermomechanical treatment The copper/low- k material configuration in the interconnect structures of today’s advanced microchips often exhibits thermo-mechanical failure during fabrication or packaging. Low- k...

... an important basis of understanding the thermo-mechanical durability behavior of Pb-free electronics under thermal cycling loading and environmental stresses. 12 04 2004 06 01 2005 tin alloys silver alloys copper alloys durability thermomechanical treatment solders assembling...

...-of-the-art of thermo-mechanical thin film characterization methods, such as the substrate curvature test, nanoindentation technique, bulge test, and impulsive stimulated thermal scattering. 24 02 2004 22 12 2004 thermal management (packaging) polymer films thermomechanical treatment...

... optoelectronics electronics packaging pulsed laser deposition thermomechanical treatment Manufacturing of optoelectronic butterfly packages involves laser welding of a fiber mount followed by a realignment procedure to reverse thermally induced distortions commonly referred to as post weld shift (PWS...

... Editor: Guo-Quon Lu. 01 December 2003 01 March 2004 06 10 2004 solders thermomechanical treatment tin alloys silver alloys copper alloys plastic deformation viscoplasticity electronics packaging finite element analysis failure analysis Due to environmental...

... height, the shear forces are decreasing but the bending moments, related to the product of shear force and stand-off height, can still increase. flip-chip devices thermomechanical treatment bending internal stresses thermal stresses integrated circuit packaging Flip chip packaging...

... arrays ceramic packaging assembling soldering thermomechanical treatment real-time systems moire fringes 01 July 2002 30 04 2004 Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received July 2002...

... issues. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received June 2003. Associate Editor: K. Kishimoto. 01 June 2003 30 04 2004 reflow soldering surface tension wetting thermomechanical...

... shown in Fig. 1 and 2 does not have symmetry along the length of the joint. soldering lead bonding adhesion thermomechanical treatment stress analysis 01 June 2003 30 04 2004 Contributed by the Electronic and Photonic Packaging Division for publication...

...X. Q. Shi,; W. Zhou,; H. L. J. Pang, and; Z. P. Wang [S1043-7398(00)01601-7] eutectic alloys soldering thermomechanical treatment stress-strain relations mechanical properties The authors mistakenly stated that the paper “On Constitutive Response of 63/37 Pn/Sb Eutectic Solder...

... joint failure in electronic assemblies 1 . This problem has become more important during the last decade with the switch to surface mount techniques from through-hole assembly, where some strain accommodation from leads is no longer available. thermomechanical treatment fatigue testing...