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Journal Articles

Effect of Dispensing Type on Void Formation Using Convolutional Neural Network

Muhammad Taufik Azahari, Calvin Ling, Aizat Abas, Fei Chong Ng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011006.
Paper No: EP-23-1004
https://doi.org/10.1115/1.4065078
Published Online: August 9, 2024
....1997.651791 [4] Lee , S. , Yim , M. J. , Master , R. N. , Wong , C. P. , and Baldwin , D. F. , 2008 , “ Void Formation Study of Flip Chip in Package Using No-Flow Underfill ,” IEEE Trans. Electron. Packag. Manuf. , 31 ( 4 ), pp. 297 – 305 . 10.1109/TEPM.2008.2002951 [5...
View Article titled, Effect of Dispensing Type on <span class="search-highlight">Void</span> <span class="search-highlight">Formation</span> Using Convolutional Neural Network
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Topics: Convolutional neural networks, Epoxy adhesives, Epoxy resins, Flip-chip devices, Flip-chip, Flow (Dynamics), Image processing
Journal Articles

Heterogeneous Void Nucleation Study in Flip Chip Assembly Process Using No-Flow Underfill

Sangil Lee, Daniel F. Baldwin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011005.
Paper No: EP-12-1068
https://doi.org/10.1115/1.4026164
Published Online: December 31, 2013
... nucleation flip chip fine pitch high I/O density no-flow underfill void formation Flip chip in package (FCIP) technology has been invented to meet the electrical and mechanical requirements of high performance devices in electronics packaging industry. Such capabilities enables it to be widely...
View Article titled, Heterogeneous Void Nucleation Study in Flip Chip Assembly Process Using No-Flow Underfill
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Topics: Flow (Dynamics), Nucleation (Physics), Temperature, Manufacturing, Solders
Journal Articles

Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill

Sangil Lee, M. J. Yim, Daniel Baldwin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031014.
https://doi.org/10.1115/1.3153369
Published Online: July 31, 2009
...Sangil Lee; M. J. Yim; Daniel Baldwin This paper investigates the void formation mechanism induced by chemical interaction between eutectic solder (Sn63/Pb37) wetting and no-flow underfill material curing during flip chip in package assembly. During the process, low weight molecular components...
View Article titled, <span class="search-highlight">Void</span> <span class="search-highlight">Formation</span> Mechanism of Flip Chip in Package Using No-Flow Underfill
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Topics: Flip-chip devices, Flow (Dynamics), Solders, Hardening (Curing), Chemical reactions, Wetting, Temperature, Flip-chip, Manufacturing