Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
NARROW
Format
Article Type
Subject Area
Topics
Date
Availability
1-2 of 2
Keywords: yield stress
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 87–93.
Published Online: April 30, 2004
.... The elastic modulus varied independent of the microstructure. A yield stress profile based on empirical hardness-yield strength correlation is predicted for the wirebond. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript...
Journal Articles
Haruo Nose, Lecturer,, Masao Sakane, Professor,, Yutaka Tsukada, Researcher, Hideo Nishimura, Researcher
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 59–66.
Published Online: March 14, 2003
..., 63Sn-37Pb, and 62Sn-36Pb-2Ag solders at the strain rates of 0.001–10.0%/s between temperatures of 313 K and 398 K. Strain rates faster than 2.0%/s were needed to obtain the time-independent Young modulus and yield stress of the solders. Tensile strength increased with increasing strain rates up to 10...
