Micro-Raman thermometry has been demonstrated to be a feasible technique for obtaining surface temperatures with micron-scale spatial resolution for microelectronic and microelectromechanical systems (MEMSs). However, the intensity of the Raman signal emerging from the probed device is very low and imposes a requirement of prolonged data collection times in order to obtain reliable temperature information. This characteristic currently limits Raman thermometry to steady-state conditions and thereby prevents temperature measurements of transient and fast time-scale events. In this paper, we discuss the extension of the micro-Raman thermometry diagnostic technique to obtain transient temperature measurements on microelectromechanical devices with temporal resolution. Through the use of a phase-locked technique we are able to obtain temperature measurements on electrically powered MEMS actuators powered with a periodic signal. Furthermore, we demonstrate a way of obtaining reliable temperature measurements on micron-scale devices that undergo mechanical movement during the device operation.
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December 2008
This article was originally published in
Journal of Heat Transfer
Research Papers
Time-Resolved Micro-Raman Thermometry for Microsystems in Motion
Justin R. Serrano,
Justin R. Serrano
Engineering Sciences Center,
Sandia National Laboratories
, Albuquerque, NM 87185-0346
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Sean P. Kearney
Sean P. Kearney
Engineering Sciences Center,
Sandia National Laboratories
, Albuquerque, NM 87185-0346
Search for other works by this author on:
Justin R. Serrano
Engineering Sciences Center,
Sandia National Laboratories
, Albuquerque, NM 87185-0346
Sean P. Kearney
Engineering Sciences Center,
Sandia National Laboratories
, Albuquerque, NM 87185-0346J. Heat Transfer. Dec 2008, 130(12): 122401 (5 pages)
Published Online: September 16, 2008
Article history
Received:
August 13, 2007
Revised:
June 10, 2008
Published:
September 16, 2008
Citation
Serrano, J. R., and Kearney, S. P. (September 16, 2008). "Time-Resolved Micro-Raman Thermometry for Microsystems in Motion." ASME. J. Heat Transfer. December 2008; 130(12): 122401. https://doi.org/10.1115/1.2976552
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