This paper deals with phase change material (PCM), used in conjunction with thermal conductivity enhancer (TCE), as a means of thermal management of electronic systems. Eicosane is used as PCM, while aluminium pin or plate fins are used as TCE. The test section considered in all cases is a base with a TCE height of . An electrical heater at the heat sink base is used to simulate the heat generation in electronic chips. Various volumetric fractions of TCE in the conglomerate of PCM and TCE are considered. The case with 8% TCE volume fraction was found to have the best thermal performance. With this volume fraction of TCE, the effects of fin dimension and fin shape are also investigated. It is found that a large number of small cross-sectional area fins is preferable. A numerical model is also developed to enable an interpretation of experimental results.
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Studies on Optimum Distribution of Fins in Heat Sinks Filled With Phase Change Materials
S. K. Saha,
S. K. Saha
Department of Mechanical Engineering,
Indian Institute of Science
, Bangalore 560 012, India
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K. Srinivasan,
K. Srinivasan
Department of Mechanical Engineering,
Indian Institute of Science
, Bangalore 560 012, India
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P. Dutta
P. Dutta
Mem. ASME
Department of Mechanical Engineering,
e-mail: pradip@mecheng.iisc.ernet.in
Indian Institute of Science
, Bangalore 560 012, India
Search for other works by this author on:
S. K. Saha
Department of Mechanical Engineering,
Indian Institute of Science
, Bangalore 560 012, India
K. Srinivasan
Department of Mechanical Engineering,
Indian Institute of Science
, Bangalore 560 012, India
P. Dutta
Mem. ASME
Department of Mechanical Engineering,
Indian Institute of Science
, Bangalore 560 012, Indiae-mail: pradip@mecheng.iisc.ernet.in
J. Heat Transfer. Mar 2008, 130(3): 034505 (4 pages)
Published Online: March 6, 2008
Article history
Received:
November 6, 2006
Revised:
July 17, 2007
Published:
March 6, 2008
Citation
Saha, S. K., Srinivasan, K., and Dutta, P. (March 6, 2008). "Studies on Optimum Distribution of Fins in Heat Sinks Filled With Phase Change Materials." ASME. J. Heat Transfer. March 2008; 130(3): 034505. https://doi.org/10.1115/1.2804948
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