This work demonstrates an innovative microfabricated air-cooling technology that employs an electrohydrodynamic (EHD) corona discharge (i.e., ionic wind pump) for electronics cooling applications. A single, microfabricated ionic wind pump element consists of two parallel collecting electrodes between which a single emitting tip is positioned. A grid structure on the collector electrodes can enhance the overall heat-transfer coefficient and facilitate an IC compatible batch process. The optimized devices studied exhibit an overall device area of 5.4 mm × 3.6 mm, an emitter-to-collector gap of ∼0.5 mm, and an emitter curvature radius of ∼12.5 μm. The manufacturing process developed for the device uses glass wafers, a single mask-based photolithography process, and a low-cost copper-based electroplating process. Various design configurations were explored and modeled computationally to investigate their influence on the cooling phenomenon. The single devices provide a high heat-transfer coefficient of up to ∼3200 W/m2 K and a coefficient of performance (COP) of up to ∼47. The COP was obtained by dividing the heat removal enhancement, ΔQ by the power consumed by the ionic wind pump device. A maximum applied voltage of 1.9 kV, which is equivalent to approximately 38 mW of power input, is required for operation, which is significantly lower than the power required for the previously reported devices. Furthermore, the microfabricated single device exhibits a flexible and small form factor, no noise generation, high efficiency, large heat removal over a small dimension and at low power, and high reliability (no moving parts); these are characteristics required by the semiconductor industry for next generation thermal management solutions.
Issue Section:
Forced Convection
Keywords:
ionic wind pump,
micro-electro-mechanical systems (MEMS),
electrohydrodynamics,
forced-convection heat transfer,
corona discharge,
electronics cooling,
heat-transfer coefficient,
coefficient of performance (COP),
FEM/FEA,
design and optimization
Topics:
Heat transfer,
Pumps,
Wind,
Electrodes,
Cooling,
Electrohydrodynamics,
Heat,
Design,
Temperature
References
1.
Ongkodjojo
, A.
, Roberts
, R. C.
, Abramson
, A. R.
, and Tien
, N. C.
, 2010
, “Highly Efficient Ionic Wind-Based Cooling Microfabricated Device for Microchip Cooling Applications
,” Technical Digest of Hilton Head Workshop 2010—A Solid-State Sensors, Actuators, and Microsystems Workshop
, Transducer Research Foundation (TRF), Inc., San Diego, CA, pp. 447
–450
.2.
Ongkodjojo
, A.
, Abramson
, A. R.
, and Tien
, N. C.
, 2010
, “Design, Modeling, and Optimization for Highly Efficient Ionic Wind-Based Cooling Microfabricated Devices
,” Proceedings of ASME 2010 International Mechanical Engineering Congress & Exposition (IMECE 2010)
, Vancouver, BC, Canada
, Paper No. IMECE2010-40427.3.
Ongkodjojo
, A.
, Abramson
, A. R.
, and Tien
, N. C.
, 2011
, “Optimized Ionic Wind-Based Cooling Microfabricated Devices for Improving a Measured Coefficient of Performance
,” Proceedings of the ASME/JSME 2011 8th Thermal Engineering Joint Conference (AJTEC 2011)
, Honolulu, HI
. Paper No. AJTEC2011-44208.4.
Ongkodjojo Ong
, A.
, Abramson
, A. R.
, and Tien
, N. C.
, 2012
, “Optimized and Microfabricated Ionic Wind Pump Array as a Next Generation Solution for Electronics Cooling Systems
,” Proceedings of ITherm 2012 (13th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems)
, San Diego, CA
, pp. 1306
–1311
.5.
Ardent
, W.
, Brillouet
, M.
, Cogez
, P.
, Graef
, M.
, Huizing
, B.
, and Mahnkopf
, M.
, eds., 2010
, “More-than-Moore
,” The ITRS White Paper, The International Technology Roadmap for Semiconductors (the ITRS), http://www.itrs.net/papers.html6.
Wang
, E. N.
, Zhang
, L.
, Jiang
, L.
, Koo
, J.-M.
, Maveety
, J. G.
, Sanchez
, E. A.
, Goodson
, K. E.
, and Kenny
, T. W.
, 2004
, “Micromachined Jets for Liquid Impingement Cooling of VLSI Chips
,” J. Microelectromech. Syst.
, 13
(5
), pp. 833
–842
.10.1109/JMEMS.2004.8357687.
Singh
, R.
, Akbarzadeh
, A.
, Dixon
, C.
, Mochizuki
, M.
, and Riehl
, R. R.
, 2007
, “Miniature Loop Heat Pipe With Flat Evaporator for Cooling Computer CPU
,” IEEE Trans. Compon. Packag. Technol.
, 30
(1
), pp. 42
–49
.10.1109/TCAPT.2007.8920668.
Maydanik
, Y. F.
, Vershinin
, S. V.
, Pastukhov
, V. G.
, and Fried
, S.
, 2010
, “Loop Heat Pipes for Cooling Systems of Servers
,” IEEE Trans. Compon. Packag. Technol.
, 33
(2
), pp. 416
–423
.10.1109/TCAPT.2009.20355149.
Majumdar
, A.
, 2009
, “Thermoelectric Devices—Helping Chips to Keep Their Cool
,” Nat. Nanotechnol.
, 4
, pp. 214
–215
.10.1038/nnano.2009.6510.
Peek
, F. W.
, 1929
, Dielectric Phenomena in High Voltage Engineering
, McGraw-Hill
, New York
.11.
Robinson
, M.
, 1961
, “Movement of Air in the Electric Wind of the Corona Discharge
,” Trans. Am. Inst. Electr. Eng.
, 80
(2
), pp. 143
–150
.12.
Papoular
, R.
, 1965
, Electrical Phenomena in Gases
, American Elsevier Publishing Co., Inc.
, New York
, Chap. 14.13.
Nasser
, E.
, 1971
, Fundamentals of Gaseous Ionization and Plasma Electronics
, John Wiley & Sons, Inc.
, New York
.14.
Chang
, J.-S.
, Lawless
, P. A.
, and Yamamoto
, T.
, 1991
, “Corona Discharge Processes
,” IEEE Trans. Plasma Sci.
, 19
(6
), pp. 1152
–1166
.10.1109/27.12503815.
Spyrou
, N.
, Peyrous
, R.
, Soulem
, N.
, and Held
, B.
, 1995
, “Why Paschen's Law Does Not Apply in Low-Pressure Gas Discharges With Inhomogeneous Fields
,” J. Phys. D: Appl. Phys.
28
(4
), pp. 701
–710
.10.1088/0022-3727/28/4/01316.
Leger
, L.
, Moreau
, E.
, and Touchard
, G. G.
, 2002
, “Effect of a DC Corona Electrical Discharge on the Airflow along a Flat Plate
,” IEEE Trans. Ind. Appl.
, 38
(6
), pp. 1478
–1485
.10.1109/TIA.2002.80476917.
Chen
, J. H.
, 2002
, “Direct Current Corona-Enhanced Chemical Reactions
,” Ph.D. thesis, University of Minnesota, MN.18.
Yamada
, K.
, 2004
, “An Empirical Formula for Negative Corona Discharge Current in Point-Grid Electrode Geometry
,” J. Appl. Phys.
, 96
(5
), pp. 2472
–2475
.10.1063/1.177530119.
Moreau
, E.
, 2007
, “Airflow Control by Non-Thermal Plasma Actuators
,” J. Phys. D: Appl. Phys.
, 40
(3
), pp. 605
–636
.10.1088/0022-3727/40/3/S0120.
Chua
, B.
, Wexler
, A. S.
, Tien
, N. C.
, Niemeier
, D. A.
, and Holmen
, B. A.
, 2008
, “Design, Fabrication, and Testing of a Microfabricated Corona Ionizer
,” IEEE/ASME J. Microelectromech. Syst.
, 17
(1
), pp. 115
–123
.10.1109/JMEMS.2007.90951521.
Ongkodjojo
, A.
, Li
, D.
, Roberts
, R. C.
, Liu
, Q.
, and Tien
, N. C.
, 2008
, “Modeling and Measurement of Microfabricated Corona Discharge Structures
,” Proceedings of the 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems
, Sanya, China
, pp. 932
–937
.22.
Chua
, B.
, Wexler
, A. S.
, Tien
, N. C.
, Niemeier
, D. A.
, and Holmen
, B. A.
, 2009
, “Electrical Mobility Separation of Airborne Particles Using Integrated Microfabricated Corona Ionizer and Separator Electrodes
,” IEEE/ASME J. Microelectromech. Syst.
, 18
(1
), pp. 4
–13
.10.1109/JMEMS.2008.201112323.
Kibler
, K. G.
, and Carter
, H. G.
, Jr., 1974
, “Electrocooling in Gases
,” J. Appl. Phys.
, 45
(10
), pp. 4436
–4440
.10.1063/1.166306924.
Velkoff
, H. R.
, and Godfrey
, R.
, 1979
, “Low-Velocity Heat Transfer to a Flat Plate in the Presence of a Corona Discharge in Air
,” ASME J. Heat Transfer
, 101
(1
), pp. 157
–163
.10.1115/1.345090725.
Owsenek
, B. L.
, and Yagoobi
, J. S.
, 1997
, “Theoretical and Experimental Study of Electrohydrodynamic Heat Transfer Enhancement Through Wire-Plate Corona Discharge
,” ASME J. Heat Transfer
, 119
(3
), pp. 604
–610
.10.1115/1.282414826.
Hsu
, C.-P.
, Jewell-Larsen
, N. E.
, Krichtafovitch
, I. A.
, Montgomery
, S. W.
, Dibene
, J. T.
, II, and Mamishev
, A. V.
, 2007
, “Miniaturization of Electrostatic Fluid Accelerators
,” IEEE/ASME J. Microelectromech. Syst.
16
(4
), pp. 809
–815
.10.1109/JMEMS.2007.89933627.
Go
, D. B.
, Maturana
, R. A.
, Fisher
, T. S.
, and Garimella
, S. V.
, 2008
, “Enhancement of External Forced Convection by Ionic Wind
,” Int. J. Heat Mass Transfer
, 51
(25–26
), pp. 6047
–6053
.10.1016/j.ijheatmasstransfer.2008.05.01228.
Jewell-Larsen
, N. E.
, Ran
, H.
, Zhang
, Y.
, Schwiebert
, M. K.
, and Honer
, K. A.
, 2009
, “Electrohydrodynamic (EHD) Cooled Laptop
,” Proceedings of the 25th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)
, San Jose, CA
, pp. 261
–266
.29.
Hsu
, C.-P.
, Jewell-Larsen
, N. E.
, Krichtafovitch
, I. A.
, and Mamishev
, A. V.
, 2009
, “Heat-Transfer-Enhancement Measurement for Microfabricated Electrostatic Fluid Accelerators
,” IEEE/ASME J. Microelectromech. Syst.
, 18
(1
), pp. 111
–118
.10.1109/JMEMS.2008.200862230.
Huang
, R.-T.
, Sheu
, W.-J.
, and Wang
, C.-C.
, 2009
, “Heat Transfer Enhancement by Needle-Arrayed Electrodes—An EHD Integrated Cooling System
,” Energy Convers. Manage.
, 50
(7
), pp. 1789
–1796
.10.1016/j.enconman.2009.03.01731.
COMSOL MULTIPHYSICS®
, Heat Transfer Module—User's Guide
, 2008
, COMSOL, Inc.
, Burlington, MA
.32.
Ongkodjojo Ong
, A.
, 2013
, “Electrohydrodynamic Microfabricated Ionic Wind Pumps for Electronics Cooling Applications
,” Ph.D. thesis, Case Western Reserve University, Cleveland, OH.33.
Dahlmann
, G. W.
, Yeatman
, E. M.
, Young
, P.
, Robertson
, I. D.
, and Lucyszyn
, S.
, 2002
, “Fabrication, RF Characteristics and Mechanical Stability of Self-Assembled 3D Microwave Inductors
,” Sens. Actuators A
, 97–98
, pp. 215
–220
.10.1016/S0924-4247(01)00851-234.
Larsen
, J. N. E.
, Hsu
, C. P.
, Krichtafovitch
, I. A.
, Montgomery
, S. W.
, Dibene
, J. T.
, II, and Mamishev
, A. V.
, 2008
, “CFD Analysis of Electrostatic Fluid Accelerators for Forced Convection Cooling
,” IEEE Trans. Dielectr. Electr. Insul.
, 15
(6
), pp. 1745
–1753
.10.1109/TDEI.2008.471268035.
Kadambi
, J. R.
, Henning
, J. C.
, and Abramson
, A. R.
, 2013
, “Measurement of Air Flow Velocities in Microsized Ionic Wind Pumps Using Particle Image Velocimetry
,” Proceedings of the ASME 4th International Conference on Micro/Nanoscale Heat and Mass Transfer
, Hong Kong, China
.36.
Incropera
, F. P.
, and Dewitt
, D. P.
, 2002
, Fundamentals of Heat and Mass Transfer
, 5th ed., John Wiley & Sons
, New York
.37.
Taylor
, J. R.
, 1997
, An Introduction to Error Analysis—The Study of Uncertainties in Physical Measurements
, 2nd ed., University Science Books
, Mill Valley, CA
.38.
Kercher
, D. S.
, Lee
, J.-B.
, Brand
, O.
, Allen
, M. G.
, and Glezer
, A.
, 2003
, “Microjet Cooling Devices for Thermal Management of Electronics
,” IEEE Trans. Compon. Packag. Technol.
, 26
(2
), pp. 359
–366
.10.1109/TCAPT.2003.81511639.
Michna
, G. J.
, Browne
, E. A.
, Peles
, Y.
, and Jensen
, M. K.
, 2011
, “The Effect of Area Ratio on Microjet Array Heat Transfer
,” Int. J. Heat Mass Transfer
, 54
(9–10
), pp. 1782
–1790
.10.1016/j.ijheatmasstransfer.2010.12.03840.
Hoberg
, T. B.
, Onstad
, A. J.
, and Eaton
, J. K.
, 2010
, “Heat Transfer Measurements for Jet Impingement Arrays With Local Extraction
,” Int. J. Heat Fluid Flow
, 31
(3
), pp. 460
–467
.10.1016/j.ijheatfluidflow.2010.01.009Copyright © 2014 by ASME
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