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Issues

J. Heat Transfer. May 2005, 127(5): 457. doi: https://doi.org/10.1115/1.1940748

Research Paper

J. Heat Transfer. May 2005, 127(5): 458–471. doi: https://doi.org/10.1115/1.1860563
J. Heat Transfer. May 2005, 127(5): 472–485. doi: https://doi.org/10.1115/1.1861919
J. Heat Transfer. May 2005, 127(5): 486–498. doi: https://doi.org/10.1115/1.1861924
J. Heat Transfer. May 2005, 127(5): 499–512. doi: https://doi.org/10.1115/1.1865218
J. Heat Transfer. May 2005, 127(5): 513–520. doi: https://doi.org/10.1115/1.1865221
J. Heat Transfer. May 2005, 127(5): 521–530. doi: https://doi.org/10.1115/1.1909208
J. Heat Transfer. May 2005, 127(5): 531–539. doi: https://doi.org/10.1115/1.1865223

Technical Briefs

J. Heat Transfer. May 2005, 127(5): 540–543. doi: https://doi.org/10.1115/1.1865219

Technology Review

J. Heat Transfer. May 2005, 127(5): 544–552. doi: https://doi.org/10.1115/1.1861921
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