... diffusion ballistic transport temperature distribution conduction electronics phonon transport LBM BTE nanoscale Thermal effects are becoming increasingly important for the proper behavior and operation of microelectronic components. This is particularly relevant for the silicon...

.... , and Slocum , A. H. , 2005 , “ A Convection/Radiation Temperature Control System for High Power Density Electronic Device Testing ” (unpublished). Sweetland , M. , 2001 , Design of Thermal Control Systems for Testing of Electronics , PhD thesis, Massachusetts Institute of Technology, Cambridge...

... of Enhanced Surfaces for High Flux Chip Cooling by Pool Boiling ,” ASME J. Electron. Packag. 1043-7398 , 115 , pp. 89 – 100 . Ramaswamy , C. , 1999 , “ A Compact Two-Phase Thermosyphon Employing Microfabricated Boiling Enhancement Structures ,” Ph.D. dissertation, University of Maryland...

... analysis Conduction Electronics Heat Transfer Microscale Modeling Nanoscale In recent years, the extreme miniaturization of integrated circuits has led to increasing concerns about the steady and unsteady thermal performance of microelectronic devices. It is now well-established...

... vapour pressure flow simulation porosity equations of state Electronics Heat Pipes Phase Change Three-Dimensional Transient Heat pipes are widely used in electronics cooling applications, both as efficient heat spreaders and to transport heat to remote heat sinks for dissipation...

... of pin fin [m] z = insert depth (see Fig. 3 ) Greek Symbols The authors acknowledge support for this work by the consortium members of the CALCE Electronics Packaging Center at the University of Maryland. The base plates employed in this study...

...G. Desrayaud; A. Fichera This paper presents the numerical predictions of heat transfer and fluid flow characteristics for natural convection in a vertical channel with two-dimensional protruding heat-flux module as applied to the cooling of electronic components. The investigation...

... by the Heat Transfer Division July 15, 2002; revision received February 14, 2003. Associate Editor: S. P. Vanka. 15 July 2002 14 February 2003 17 07 2003 jets cooling heat transfer temperature distribution flow simulation Navier-Stokes equations Convection Electronics...

... December 17, 2001; revision received July 3, 2002. Associate Editor: D. Poulikakos. 17 December 2001 03 July 2002 29 01 2003 infrared imaging finite element analysis liquid films Electronics Heat Transfer Microscale Microstructures Nanoscale Nonintrusive Diagnostics...

... 2002 29 01 2003 heat transfer boiling two-phase flow cooling flow through porous media channel flow Boiling Electronics Enhancement Experimental Heat Transfer Microstructures Enhanced structures are often used to improve the two-phase heat transfer, over plain...

... 01 2003 thermal variables control temperature control distributed parameter systems integrated circuit design integrated circuit packaging Conduction Control Electronics Heat Transfer Temperature All high-performance electronic devices are subject to a 100 percent...

... thermal conductivity thermoreflectance Computational Electronics Experimental Heat Transfer Thin Films The performance of electronic and telecommunication devices depends heavily on electro-thermal interactions, making the knowledge of material properties fundamental to the design...

...S. I. Haider; Yogendra K. Joshi; Wataru Nakayama This study presents a model for the two-phase flow and heat transfer in the closed loop, two-phase thermosyphon (CLTPT) involving co-current natural circulation. The focus is on CLTPTs for electronics cooling that exhibit complex two-phase flow...

...T. S. Fisher; D. G. Walker This paper considers the theory of electron field emission from nanoscale emitters with particular focus on thermal and electrical energy transport. The foundational theory of field emission is explored, and a model is presented that accounts explicitly for the energy...

... larger than a prediction using the heat diffusion equation for the entire domain. The disparity results both from phonon-boundary scattering and from the small dimensions of the region of strongest electron-phonon energy transfer. This work clearly shows the importance of sub-continuum heat conduction...

... electronic components. Comparisons of the obstacle mean Nusselt numbers are made with a two-dimensional laminar numerical model employing the Navier-Stokes equations. A set of correlations characterizing the heat transfer from the protruding heat sources within the channel is obtained. It was found...

... and point to that it can be optimized geometrically. The path can be arranged optimally in space. The geometric optimization of assemljlies of heat-generating components is also an essential feature of many of the more recent contributions to the cooling of electronics (e.g., Bar- Cohen and Rohsenow, 1984...

... network that is completely deterministic. 30 Dec 1997 24 June 1998 05 12 2007 Conduction Cooling Electronics Finned Surfaces Heat Transfer Thermodynamics Aung, W., ed., 1988, Cooling Technology for Electronic Equipment , Hemisphere, New York. Bejan A. , 1997...

... and greases have also been implemented. This review article covers recent developments in heat sink designs and applications intended for high-end high-power dissipation systems. A review of recent studies of card effects in the thermal enhancement of electronic packages is also presented. In certain...

... 1998 05 12 2007 Electronics Finned Surfaces Heat Transfer Natural Convection Optimization Aihara T. , Maruyama S. , and Kobayakawa S. , 1990 , “ Free Convective/Radiative Heat Transfer from Pin-Fin Arrays with a Vertical Base Plate (general representation of heat...