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Keywords: multichip modules
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Journal Articles
Publisher: ASME
Article Type: Article
J. Heat Mass Transfer. January 2005, 127(1): 76–84.
Published Online: February 15, 2005
... enhancement of a multichip module package with a thermoelectric cooler is discussed. The analysis utilizes closed form equations incorporating both thermoelectric cooler parameters and package level thermal resistances to relate allowable module power to chip temperature. Comparisons are made of allowable...