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Keywords: thermoelectric devices
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Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. June 2009, 131(6): 064505.
Published Online: April 13, 2009
...) thermoelectric devices Similar systems have been developed for low mass applications, specifically for microscale systems driven by the need for thermal control in computer microprocessors ( 1 2 3 4 ). Our study of the thermal control of high mass systems utilizes thermo-electric coolers (TECs). Some...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. September 2006, 128(9): 889–896.
Published Online: February 7, 2006
...) of the electro-adsorption chiller is expressed in terms of the cycle-average cooling rate of the overall device, i.e., the rate of heat extraction at the evaporator ( Q e v a p ) and the power input from the thermoelectric device ( P i n ) . The overall or net COP is COP...
Journal Articles
Publisher: ASME
Article Type: Article
J. Heat Mass Transfer. January 2005, 127(1): 108–114.
Published Online: February 15, 2005
.... 21 May 2004 31 July 2004 15 02 2005 silicon Ge-Si alloys semiconductor superlattices Peltier effect thermal conductivity nanowires thermoelectric devices phonons semiconductor quantum wires elemental semiconductors cooling reviews 6 Device performance of a Si...
Journal Articles
Publisher: ASME
Article Type: Article
J. Heat Mass Transfer. January 2005, 127(1): 76–84.
Published Online: February 15, 2005
... Manuscript received April 19, 2004; revision received November 3, 2004. Review conducted by: C. Amon. 19 April 2004 03 November 2004 15 02 2005 thermoelectric conversion multichip modules cooling thermal resistance thermoelectric devices thermoelectricity Many advances...