In-plane stress distribution in a spinning free-clamped slicing blade is studied analytically. The blade is subjected to a stationary, distributed, in-plane slicing load along the inner periphery, while it is clamped and tensioned initially in the radial direction along the outer boundary. The radial, hoop, and shear stresses in the blade are given by sum of the stresses from the tensioning, spinning, and edge loading. The solution is obtained by introducing the Laˆme potential functions and the two-dimensional elasticity theory. Numerical results are presented for an actual SUS301 blade cutting a 6-in.-diameter silicon ingot at 1550 rpm. Results obtained show that the contribution of the slicing load on the stress distribution is not significant; further the overall stress distribution is approximated by that of the initial tensioning except for the case of the shear stress distribution.
Skip Nav Destination
Article navigation
December 1993
Research Papers
Stress Analysis of a Silicon-Wafer Slicer Cutting the Crystal Ingot
S. Chonan,
S. Chonan
Department of Aeronautics and Space Engineering, Tohoku University, Sendai, Japan
Search for other works by this author on:
Z. W. Jiang,
Z. W. Jiang
Department of Aeronautics and Space Engineering, Tohoku University, Sendai, Japan
Search for other works by this author on:
Y. Yuki
Y. Yuki
Toyo Engineering, Co., Ltd., Japan
Search for other works by this author on:
S. Chonan
Department of Aeronautics and Space Engineering, Tohoku University, Sendai, Japan
Z. W. Jiang
Department of Aeronautics and Space Engineering, Tohoku University, Sendai, Japan
Y. Yuki
Toyo Engineering, Co., Ltd., Japan
J. Mech. Des. Dec 1993, 115(4): 711-717 (7 pages)
Published Online: December 1, 1993
Article history
Received:
January 1, 1992
Online:
June 2, 2008
Citation
Chonan, S., Jiang, Z. W., and Yuki, Y. (December 1, 1993). "Stress Analysis of a Silicon-Wafer Slicer Cutting the Crystal Ingot." ASME. J. Mech. Des. December 1993; 115(4): 711–717. https://doi.org/10.1115/1.2919259
Download citation file:
Get Email Alerts
Related Articles
Vibration and Deflection of a Silicon-Wafer Slicer Cutting the Crystal Ingot
J. Vib. Acoust (October,1993)
Modeling Stresses of Contacts in Wire Saw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production
J. Electron. Packag (June,1998)
Stress Analysis of a Spinning Annular Disk to a Stationary Distributed, In-Plane Edge Load
J. Vib., Acoust., Stress, and Reliab (July,1987)
Strain-Modulated Adatom and Surface Vacancy Pair
Interactions
J. Appl. Mech (May,2005)
Related Proceedings Papers
Related Chapters
A Utility Perspective of Wind Energy
Wind Turbine Technology: Fundamental Concepts in Wind Turbine Engineering, Second Edition
Stress Analysis of Gas Turbine Blade under Different Loads Using Finite Element Modeling
International Conference on Mechanical and Electrical Technology, 3rd, (ICMET-China 2011), Volumes 1–3
Insulating Properties of W-Doped Ga2O3 Films Grown on Si Substrate for Low-K Applications
International Conference on Advanced Computer Theory and Engineering, 4th (ICACTE 2011)