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Proceedings Papers

Predictions of Airside Economization-Based Air-Cooled Data Center Environmental Burden Reduction

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 25–27, 2022

Paper No: IPACK2022-92005

DOI: https://doi.org/10.1115/IPACK2022-92005

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Topics: Carbon, Data centers, Energy consumption, Stress, Water

Proceedings Papers

Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers

Lucas Arrivo, Steven Schon, Aaron P. Wemhoff

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 26–28, 2021

Paper No: IPACK2021-73015

DOI: https://doi.org/10.1115/IPACK2021-73015

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Topics: Contact resistance, Cooling, Data centers, Electronics, Foams (Chemistry), Plates (structures), Bonding, Heat transfer, Metal foams, Modeling

Proceedings Papers

Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Evaporator Model

Rehan Khalid, Raffaele Luca Amalfi, Aaron P. Wemhoff

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 26–28, 2021

Paper No: IPACK2021-73269

DOI: https://doi.org/10.1115/IPACK2021-73269

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Topics: Compression, Cooling, Data centers, Heat recovery, Vapors

Proceedings Papers

Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Condenser Model

Rehan Khalid, Raffaele Luca Amalfi, Aaron P. Wemhoff

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, October 26–28, 2021

Paper No: IPACK2021-73270

DOI: https://doi.org/10.1115/IPACK2021-73270

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Topics: Compression, Condensers (steam plant), Cooling, Heat recovery, Modeling, Thermal management, Vapors

Proceedings Papers

Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Compressor Model

Rehan Khalid, Raffaele Luca Amalfi, Aaron P. Wemhoff

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, October 26–28, 2021

Paper No: IPACK2021-73271

DOI: https://doi.org/10.1115/IPACK2021-73271

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Topics: Compression, Compressors, Cooling, Heat recovery, Modeling, Thermal management, Vapors

Journal Articles

Coupled Calculations of Data Center Cooling and Power Distribution Systems

Aaron P. Wemhoff, Faisal Ahmed

J. Electron. Packag. December 2022, 144(4): 041002.

Paper No: EP-21-1044

DOI: https://doi.org/10.1115/1.4052101

Published Online: October 6, 2021

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Topics: Cooling, Cooling systems, Data centers, Power systems (Machinery), Stress, Energy efficiency, Electronic systems, Uncertainty

Journal Articles

Study of a Lab-Scale Organic Rankine Cycle for the Ultra-Low-Temperature Waste Heat Recovery Associated With Data Centers

Sebastian Araya, Aaron P. Wemhoff, Gerard F. Jones, Amy S. Fleischer

J. Electron. Packag. June 2021, 143(2): 021001.

Paper No: EP-19-1102

DOI: https://doi.org/10.1115/1.4047843

Published Online: August 7, 2020

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Topics: Heat, Heat recovery, Organic Rankine cycle, Temperature, Data centers, Pumps

Journal Articles

Thermal Control Strategies for Reliable and Energy-Efficient Data Centers

Rehan Khalid, Aaron P. Wemhoff

J. Electron. Packag. December 2019, 141(4): 041004.

Paper No: EP-18-1058

DOI: https://doi.org/10.1115/1.4044129

Published Online: July 12, 2019

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Topics: Cooling systems, Data centers, Energy consumption, Flow (Dynamics), Reliability, Temperature, Energy efficiency, Simulation, Control equipment

Journal Articles

The Performance Impact of Integrating Water Storage Into a Chiller-Less Data Center Design

Isaac Rose, Aaron P. Wemhoff, Amy S. Fleischer

J. Thermal Sci. Eng. Appl. April 2019, 11(2): 021010.

Paper No: TSEA-17-1498

DOI: https://doi.org/10.1115/1.4041804

Published Online: December 5, 2018

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Topics: Cooling, Data centers, Design, Exergy, Flow (Dynamics), Temperature, Water, Water storage, Cooling towers, Heat exchangers

Proceedings Papers

Load Capacity and Thermal Efficiency Optimization of a Research Data Center Using Computational Modeling

Joseph R. H. Schaadt, Kamran Fouladi, Aaron P. Wemhoff, Joseph G. Pigeon

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A020, July 6–9, 2015

Paper No: IPACK2015-48364

DOI: https://doi.org/10.1115/IPACK2015-48364

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Topics: Computer simulation, Data centers, Optimization, Stress, Thermal efficiency, Design, Containment, Computational fluid dynamics, Air conditioning, Flow (Dynamics)

Proceedings Papers

Predictions of Adsorption Enthalpy on Graphitic Surfaces Using Statistical Thermodynamics

Aaron P. Wemhoff

Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A017, July 14–19, 2013

Paper No: HT2013-17365

DOI: https://doi.org/10.1115/HT2013-17365

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Topics: Enthalpy, Statistical mechanics, Fluids, Graphite, Desorption, Methanol, Temperature

Proceedings Papers

Molecular-Based Theory for Drag on a Circular Cylinder by a Liquid

Aaron P. Wemhoff

Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 975-982, November 9–15, 2012

Paper No: IMECE2012-87895

DOI: https://doi.org/10.1115/IMECE2012-87895

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Topics: Circular cylinders, Drag (Fluid dynamics), Fluids, Blood vessels, Chain, Fibers, Linings (Textiles), Proteins

Proceedings Papers

GPU-Based Molecular Dynamics Formulation of Thermal Conductivity Predictions for Monolayer Graphene

Aaron P. Wemhoff, Masoud H. Khadem

Proc. ASME. HT2012, Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer, 891-896, July 8–12, 2012

Paper No: HT2012-58020

DOI: https://doi.org/10.1115/HT2012-58020

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Topics: Graphene, Graphics processing units, Molecular dynamics, Thermal conductivity, Computation, Engineering simulation, Equilibrium (Physics), Errors, Heat, Potential energy

Proceedings Papers

Directing Supervisory Control Towards Real HVAC System Integration

Aaron P. Wemhoff, William Flaherty

Proc. ASME. IMECE2011, Volume 4: Energy Systems Analysis, Thermodynamics and Sustainability; Combustion Science and Engineering; Nanoengineering for Energy, Parts A and B, 923-929, November 11–17, 2011

Paper No: IMECE2011-62529

DOI: https://doi.org/10.1115/IMECE2011-62529

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Topics: HVAC equipment, Energy consumption, Air conditioning, Air flow, Algorithms, Computer software, Control equipment, Heating, Stress, Transients (Dynamics)

Proceedings Papers

Thermal Conductivity Estimation of Nano Graphene Using Equilibrium Molecular Dynamics With Andersen and Berendsen Thermostats

Masoud H. Khadem, Aaron P. Wemhoff

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 293-299, November 11–17, 2011

Paper No: IMECE2011-62562

DOI: https://doi.org/10.1115/IMECE2011-62562

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Topics: Equilibrium (Physics), Graphene, Molecular dynamics, Temperature controls, Thermal conductivity, Atoms, Carbon, Engineering simulation, Fluctuations (Physics), Heat

Journal Articles

Thermophysical Phenomena Associated With Nano-Droplet Impingement on a Solid Surface

Geoffrey M. Haas, Aaron P. Wemhoff

J. Heat Transfer. July 2012, 134(7): 071503.

DOI: https://doi.org/10.1115/1.4006099

Published Online: May 24, 2012

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Topics: Drops, Temperature

Proceedings Papers

HVAC System Energy Minimization via Optimization of Lumped System Models

Aaron P. Wemhoff

Proc. ASME. IMECE2010, Volume 5: Energy Systems Analysis, Thermodynamics and Sustainability; NanoEngineering for Energy; Engineering to Address Climate Change, Parts A and B, 1339-1345, November 12–18, 2010

Paper No: IMECE2010-37163

DOI: https://doi.org/10.1115/IMECE2010-37163

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Topics: Energy conservation, HVAC equipment, Optimization, Steady state, Stress, Air conditioning, Energy consumption, Heating, Interpolation, Simulation

Proceedings Papers

Nano-Droplet Impingement Heat Transfer on a Solid Surface

Geoffrey Haas, Aaron P. Wemhoff

Proc. ASME. IMECE2010, Volume 7: Fluid Flow, Heat Transfer and Thermal Systems, Parts A and B, 83-88, November 12–18, 2010

Paper No: IMECE2010-39734

DOI: https://doi.org/10.1115/IMECE2010-39734

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Topics: Drops, Heat transfer, Cooling, Nanoscale phenomena, Simulation, Collisions (Physics), Dimensions, Electronic components, Electronics, Molecular dynamics

Proceedings Papers

Molecular Dynamics Predictions of Thermal Conductivity in Graphene for Phase Change Energy Storage Applications

Masoud H. Khadem, Aaron P. Wemhoff

Proc. ASME. ES2011, ASME 2011 5th International Conference on Energy Sustainability, Parts A, B, and C, 1293-1298, August 7–10, 2011

Paper No: ES2011-54158

DOI: https://doi.org/10.1115/ES2011-54158

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Topics: Energy storage, Graphene, Molecular dynamics, Thermal conductivity, Engineering simulation, Simulation, Atoms, Carbon, Equilibrium (Physics), Molecular dynamics simulation

Proceedings Papers

Optimization of Equipment Control Parameters to Minimize HVAC Energy Consumption

Aaron P. Wemhoff

Proc. ASME. ES2011, ASME 2011 5th International Conference on Energy Sustainability, Parts A, B, and C, 35-40, August 7–10, 2011

Paper No: ES2011-54063

DOI: https://doi.org/10.1115/ES2011-54063

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Topics: Energy consumption, HVAC equipment, Optimization, Air conditioning, Dampers, Heating, Lumped parameter models, Steady state, Stress

Journal citation

NARROW

Predictions of Airside Economization-Based Air-Cooled Data Center Environmental Burden Reduction

Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers

Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Evaporator Model

Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Condenser Model

Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Compressor Model

Coupled Calculations of Data Center Cooling and Power Distribution Systems

Study of a Lab-Scale Organic Rankine Cycle for the Ultra-Low-Temperature Waste Heat Recovery Associated With Data Centers

Thermal Control Strategies for Reliable and Energy-Efficient Data Centers

The Performance Impact of Integrating Water Storage Into a Chiller-Less Data Center Design

Load Capacity and Thermal Efficiency Optimization of a Research Data Center Using Computational Modeling

Predictions of Adsorption Enthalpy on Graphitic Surfaces Using Statistical Thermodynamics

Molecular-Based Theory for Drag on a Circular Cylinder by a Liquid

GPU-Based Molecular Dynamics Formulation of Thermal Conductivity Predictions for Monolayer Graphene

Directing Supervisory Control Towards Real HVAC System Integration

Thermal Conductivity Estimation of Nano Graphene Using Equilibrium Molecular Dynamics With Andersen and Berendsen Thermostats

Thermophysical Phenomena Associated With Nano-Droplet Impingement on a Solid Surface

HVAC System Energy Minimization via Optimization of Lumped System Models

Nano-Droplet Impingement Heat Transfer on a Solid Surface

Molecular Dynamics Predictions of Thermal Conductivity in Graphene for Phase Change Energy Storage Applications

Optimization of Equipment Control Parameters to Minimize HVAC Energy Consumption

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