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B. G. Sammakia
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Journal Articles

An Improved Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials

B. Dan, B. G. Sammakia, G. Subbarayan, S. Kanuparthi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031003.
Paper No: EP-12-1098
https://doi.org/10.1115/1.4024392
Published Online: June 4, 2013
View Article titled, An Improved Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials
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Topics: Particulate matter, Thermal conductivity, Electrical conductance, Network models, Approximation
Journal Articles

Thermal Solution Maps: A Strategy for Thermal Design of Three-Dimensional Packages

M. Rayasam, S. Chaparala, D. Farnam, B. G. Sammakia, G. Subbarayan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011015.
https://doi.org/10.1115/1.3077131
Published Online: February 25, 2009
View Article titled, Thermal Solution Maps: A Strategy for Thermal Design of Three-Dimensional Packages
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Topics: Design, Microchannels, Optimization, Heat
Proceedings Papers

Molecular Dynamics Simulations of Nanotube-Polymer Composites for Use as Thermal Interface Material

S. Mahajan, G. Subbarayan, B. G. Sammakia, W. Jones
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 381-385, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42462
https://doi.org/10.1115/IMECE2003-42462
View Paper titled, Molecular Dynamics Simulations of Nanotube-Polymer Composites for Use as Thermal Interface Material
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Topics: Composite materials, Molecular dynamics simulation, Nanotubes, Polymers, Thermal conductivity, Carbon nanotubes, Microelectronic devices, Thermal management, Bonding, Carbon
Proceedings Papers

An Analytical Study of the Optimized Performance of an Impingement Heat Sink

S. B. Sathe, B. G. Sammakia
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 785-799, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-55461
https://doi.org/10.1115/IMECE2003-55461
View Paper titled, An Analytical Study of the Optimized Performance of an Impingement Heat Sink
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Topics: Heat sinks, Pressure drop, Fins, Flow (Dynamics), Heat transfer, Heat transfer coefficients, Cooling, Cross-flow, Cutting, Nozzles
Journal Articles

An Analytical Study of the Optimized Performance of an Impingement Heat Sink

S. B. Sathe, B. G. Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 528–534.
https://doi.org/10.1115/1.1827269
Published Online: January 24, 2005
View Article titled, An Analytical Study of the Optimized Performance of an Impingement Heat Sink
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Topics: Design, Flow (Dynamics), Heat sinks, Pressure drop, Computation, Heat transfer, Fins
Journal Articles

The Impact of Interfacial Adhesion on PTH and Via Stress State

G. Subbarayan, K. Ramakrishna, B. G. Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 260–267.
https://doi.org/10.1115/1.2792247
Published Online: December 1, 1997
View Article titled, The Impact of Interfacial Adhesion on PTH and Via Stress State
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Topics: Adhesion, Stress, Laminates, Fracture (Materials), Fracture (Process), Plating, Drills (Tools), Finite element analysis, Junctions, Manufacturing