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Journal Articles

Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning

Ali Heydari, Qusai Soud, Mohammad Tradat, Ahmad R. Gharaibeh, Najmeh Fallahtafti, Jeremy Rodriguez, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041106.
Paper No: EP-24-1021
https://doi.org/10.1115/1.4065942
Published Online: July 26, 2024
View Article titled, Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning
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Topics: Air conditioning, Coolants, Cooling, Temperature, Vehicles, Stress, Heat, HVAC equipment, Noise (Sound), Flow (Dynamics)
Journal Articles

Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks

Ali Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Jeremy Rodriguez, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041102.
Paper No: EP-24-1007
https://doi.org/10.1115/1.4065537
Published Online: June 17, 2024
View Article titled, Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks
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Topics: Coolants, Cooling, Data centers, Density, Heat, Heat exchangers, Temperature, Fluids, Stress, Cooling systems
Journal Articles

Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module

Ahmad R. Gharaibeh, Qusai Soud, Yaman Manaserh, Mohammad Tradat, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041101.
Paper No: EP-24-1006
https://doi.org/10.1115/1.4065446
Published Online: May 24, 2024
View Article titled, Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module
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Topics: Computer simulation, Cooling, Flow (Dynamics), Heat, Heat sinks, Multi-chip modules, Pressure drop, Temperature, Fluids, Coolants
Proceedings Papers

Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multi-Chip Module

Ahmad R. Gharaibeh, Qusai Soud, Yaman Manaserh, Mohammad Tradat, Bahgat Sammakia
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112452
https://doi.org/10.1115/IPACK2023-112452
View Paper titled, Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multi-Chip Module
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Topics: Cooling, Heat sinks, Multi-chip modules
Proceedings Papers

Performance Analysis of Liquid-to-Air Heat Exchangers of High-Power Density Racks

Ali Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Bahgat Sammakia, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112404
https://doi.org/10.1115/IPACK2023-112404
View Paper titled, Performance Analysis of Liquid-to-Air Heat Exchangers of High-Power Density Racks
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Topics: Cooling, Data centers, Density, Heat, Heat exchangers
Proceedings Papers

L2A CDUs Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning

Ali Heydari, Qusai Soud, Mohammad Tradat, Ahmad Gharaibeh, Najmeh Fallahtafti, Jeremy Rodriguez, Bahgat Sammakia
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111564
https://doi.org/10.1115/IPACK2023-111564
View Paper titled, L2A CDUs Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning
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Topics: Air conditioning, Cooling, Coolants, Heat, HVAC equipment, Artificial intelligence, Cooling loads, Data centers, Density, Fans
Proceedings Papers

Liquid to Air Cooling for High Heat Density Liquid Cooled Data Centers

Ali Heydari, Vahideh Radmard, Bahareh Eslami, Mohammad I. Tradat, Yaman Manaserh, Harold Miyamura, Uschas Chowdhury, Pardeep Shahi, Kevin Dave Hall, Bahgat Sammakia, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97386
https://doi.org/10.1115/IPACK2022-97386
View Paper titled, Liquid to Air Cooling for High Heat Density Liquid Cooled Data Centers
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Topics: Cooling, Data centers, Density, Heat, Heat exchangers
Proceedings Papers

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

William T. Chen, David Questad, David Read, Bahgat Sammakia
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 183-192, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0515
https://doi.org/10.1115/IMECE1997-0515
View Paper titled, Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry
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Topics: Fracture mechanics, Microelectronic packaging, Packaging, Ball-Grid-Array packaging, Electronic packaging, Design, Electronic packages, Electronic products, Low temperature, Manufacturing
Journal Articles

A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification

Ghazal Mohsenian, Cong Hiep Hoang, Kourosh Nemati, Hussam Alissa, Mohammad Tradat, Najmeh Fallahtafti, Vahideh Radmard, Bruce Murray, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041015.
Paper No: EP-21-1139
https://doi.org/10.1115/1.4053643
Published Online: February 23, 2022
View Article titled, A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification
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Topics: Air flow, Design, Stress, Flow (Dynamics), Control systems, Heat, Data centers, Inertia (Mechanics)
Proceedings Papers

Thermal Issues That Arise due to Manufacturing Processes: Evaluation and Measurement Techniques

Bahgat Sammakia, Sanjeev Sathe
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 121-138, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0925
https://doi.org/10.1115/IMECE1999-0925
View Paper titled, Thermal Issues That Arise due to Manufacturing Processes: Evaluation and Measurement Techniques
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Topics: Manufacturing, Heat sinks, Adhesives, Delamination, Design, Lamination, Signals, Stress, Accounting, Ball-Grid-Array packaging
Proceedings Papers

Selection of Method for Fatigue Life Prediction Under Random Loading

Amit Awasthi, Stephen Mckeown, C. Sahay, Bahgat Sammakia
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 289-304, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24738
https://doi.org/10.1115/IMECE2001/EPP-24738
View Paper titled, Selection of Method for Fatigue Life Prediction Under Random Loading
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Topics: Algorithms, Aluminum, Copper, Cycles, Electronic packages, Fatigue, Fatigue failure, Fatigue life, Fatigue testing, Gaussian distribution
Proceedings Papers

Some Transport Issues in the Development, Qualification, and Manufacture of Electronic Packages

Bahgat Sammakia, Koneru Ramakrishna, Frank Andros, Jayathi Y. Murthy, Vijay Sarihan, D. H. R. Sarma, Sanjeev Sathe
Proc. ASME. IMECE2001, Manufacturing Engineering, 461-463, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MED-23350
https://doi.org/10.1115/IMECE2001/MED-23350
View Paper titled, Some Transport Issues in the Development, Qualification, and Manufacture of Electronic Packages
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Topics: Adhesives, Computer cooling, Computer simulation, Computers, Concurrent engineering, Design, Drilling, Electronic packages, Electronics, Engineering design processes
Journal Articles

Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model

Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021104.
Paper No: EP-20-1142
https://doi.org/10.1115/1.4052074
Published Online: September 24, 2021
View Article titled, Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model
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Topics: Composite materials, Energy storage, Thermal conductivity, Electronics, Optimization, Temperature, Design, Heat sinks, Latent heat, Phase change materials
Journal Articles

Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid

Bharath Ramakrishnan, Cong Hiep Hoang, Sadegh Khalili, Yaser Hadad, Srikanth Rangarajan, Arvind Pattamatta, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020904.
Paper No: EP-20-1119
https://doi.org/10.1115/1.4049928
Published Online: March 5, 2021
View Article titled, Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid
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Topics: Boiling, Coolants, Cooling, Data centers, Density, Flow (Dynamics), Fluids, Heat flux, Heat transfer coefficients, Plates (structures)
Proceedings Papers

Effective Thermal Conductivity of Phase Change Material-Based Composites for High Heat Flux Electronic Cooling

Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2562
https://doi.org/10.1115/IPACK2020-2562
View Paper titled, Effective Thermal Conductivity of Phase Change Material-Based Composites for High Heat Flux Electronic Cooling
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Topics: Composite materials, Computer cooling, Heat flux, Heat sinks, Phase change materials, Thermal conductivity
Proceedings Papers

Liquid Cooling Utilizing a Hybrid Microchannel/Multi-Jet Heat Sink: A Component Level Study of Commercial Product

Cong Hiep Hoang, Mohammad Tradat, Yaman Manaserh, Bharath Ramakrisnan, Srikanth Rangarajan, Yaser Hadad, Scott Schiffres, Bahgat Sammakia
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A008, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2627
https://doi.org/10.1115/IPACK2020-2627
View Paper titled, Liquid Cooling Utilizing a Hybrid Microchannel/Multi-Jet Heat Sink: A Component Level Study of Commercial Product
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Topics: Cooling, Fins, Heat sinks, Microchannels, Pressure drop, Thermal resistance
Journal Articles

Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks

Yaser Hadad, Vahideh Radmard, Srikanth Rangarajan, Mahdi Farahikia, Gamal Refai-Ahmed, Paul R. Chiarot, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021007.
Paper No: EP-19-1111
https://doi.org/10.1115/1.4048590
Published Online: October 30, 2020
View Article titled, Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks
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Topics: Design, Electrical resistivity, Flow (Dynamics), Pumps, Temperature, Optimization, Microchannels, Coolants, Pareto optimization, Heat flux
Journal Articles

An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads

Sadegh Khalili, Srikanth Rangarajan, Vadim Gektin, Husam Alissa, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041002.
Paper No: EP-19-1138
https://doi.org/10.1115/1.4048180
Published Online: September 4, 2020
View Article titled, An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads
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Topics: Coolants, Cooling, Cooling systems, Flow (Dynamics), Fluids, Heat, Manifolds, Pressure, Stress, Temperature
Journal Articles

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

Srikanth Rangarajan, Yaser Hadad, Leila Choobineh, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041109.
Paper No: EP-19-1123
https://doi.org/10.1115/1.4047471
Published Online: June 29, 2020
View Article titled, Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits
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Topics: Genetic algorithms, Heat, Optimization, Temperature, Artificial neural networks, Heat transfer, Integrated circuits, Algorithms, Boundary-value problems
Proceedings Papers

Optimal Arrangement of Multiple Heat Sources in Vertically Stacked Two-Layer 3-D IC Using Genetic Algorithm

Srikanth Rangarajan, Yaser Hadad, Leila Choobineh, Bahgat Sammakia
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6334
https://doi.org/10.1115/IPACK2019-6334
View Paper titled, Optimal Arrangement of Multiple Heat Sources in Vertically Stacked Two-Layer 3-D IC Using Genetic Algorithm
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Topics: Artificial neural networks, Genetic algorithms, Heat