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Bernd Michel
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Proceedings Papers

The MicroDAC Method: A Powerful Means for Microdeformation Analysis in Electronic Packaging

Bernd Michel, Dietmar Vogel, Andreas Schubert, Jürgen Auersperg, Herbert Reichl
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 117-123, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1236
https://doi.org/10.1115/IMECE1997-1236
View Paper titled, The MicroDAC Method: A Powerful Means for Microdeformation Analysis in Electronic Packaging
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Topics: Algorithms, Computers, Displacement, Displacement measurement, Electron microscopy, Electronic packaging, Engineering simulation, Failure, Finite element analysis, Flip-chip assemblies
Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0508
https://doi.org/10.1115/IMECE1997-0508
View Paper titled, Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC
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Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination
Proceedings Papers

Mixed Mode Interfacial Fracture Toughness Evaluation for Flip-Chip Assemblies and CSP Based on Fracture Mechanics Approaches

Jürgen Auersperg, Eva Kieselstein, Andreas Schubert, Bernd Michel
Proc. ASME. IMECE2001, Threaded and Riveted Connections, Design Issues, Reliability, Stress Analysis, and Failure Prevention, 89-94, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/DE-25109
https://doi.org/10.1115/IMECE2001/DE-25109
View Paper titled, Mixed Mode Interfacial Fracture Toughness Evaluation for Flip-Chip Assemblies and CSP Based on Fracture Mechanics Approaches
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Topics: Electronic packages, Flip-chip assemblies, Fracture (Process), Fracture mechanics, Fracture toughness, Reliability, Thermomechanics, Delamination, Damage, Fatigue
Proceedings Papers

An Integrated Experimental and Theoretical Approach to Evaluate Si Strength Dependent on the Processing History

John Brueckner, Rainer Dudek, Sven Rzepka, Bernd Michel
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 139-145, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89270
https://doi.org/10.1115/InterPACK2009-89270
View Paper titled, An Integrated Experimental and Theoretical Approach to Evaluate Si Strength Dependent on the Processing History
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Topics: Anisotropy, Brittleness, Ceramics, Damage, Experimental characterization, Failure, Finite element analysis, Fracture (Process), Grinding, Grinding wheels
Proceedings Papers

Localized High-Resolution Stress Measurements on MEMS Structures

Dietmar Vogel, Astrid Gollhardt, Bernd Michel
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 743-747, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89106
https://doi.org/10.1115/InterPACK2009-89106
View Paper titled, Localized High-Resolution Stress Measurements on MEMS Structures
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Topics: Microelectromechanical systems, Resolution (Optics), Stress, Electron backscatter diffraction, Focused ion beams, Milling, Raman spectroscopy
Journal Articles

Reliability Prediction of Area Array Solder Joints

Rainer Dudek, Ralf Do¨ring, Bernd Michel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 562–568.
https://doi.org/10.1115/1.1604802
Published Online: December 15, 2003
View Article titled, Reliability Prediction of Area Array Solder Joints
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Topics: Ball-Grid-Array packaging, Creep, Fatigue, Modeling, Reliability, Solder joints, Solders, Temperature, Cycles, Geometric modeling
Journal Articles

Special Issue on Poly’2000, London

Bernd Michel,, Guest Editor, Poly’2000 Co-chair, Kikuo Kishimoto,, Guest Editor, Poly’2000 Co-chair
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2002, 124(4): 317.
https://doi.org/10.1115/1.1497626
Published Online: December 12, 2002
View Article titled, Special Issue on Poly’2000, London
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Topics: Adhesion, Adhesives, Fracture mechanics, Integrated circuit packaging, Packaging, Polymers, Reliability, Stress, Thermal management, Workshops (Work spaces)