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Journal Articles

Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

Shou-Jen Hsu, Chin C. Lee

Publisher: ASME

J. Electron. Packag. December 2016, 138(4): 041006.

Paper No: EP-16-1095

https://doi.org/10.1115/1.4034842

Published Online: October 10, 2016

View Article titled, Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

Topics: Annealing, Intermetallic compounds, Solders, Temperature, Tin, Diffusion (Physics), Carbon, Steel

Journal Articles

The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes

Yuan-Yun Wu, Chin C. Lee

Publisher: ASME

J. Electron. Packag. March 2014, 136(1): 011006.

Paper No: EP-13-1063

https://doi.org/10.1115/1.4026171

Published Online: January 8, 2014

View Article titled, The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes

Topics: Alloys, Bonding, Copper, Design, High temperature, Low temperature, Shear (Mechanics), Silver, Solid solutions, Temperature

Journal Articles

40 μ m Copper–Silver Composite Flip-Chip Interconnect Technology Using Solid-State Bonding

Chu-Hsuan Sha, Wen P. Lin, Chin C. Lee

Publisher: ASME

J. Electron. Packag. June 2012, 134(2): 021004.

https://doi.org/10.1115/1.4006705

Published Online: June 11, 2012

View Article titled, 40 μ m Copper–Silver Composite Flip-Chip Interconnect Technology Using Solid-State Bonding

Topics: Bonding, Composite materials, Copper, Flip-chip, Silicon chips, Silver

Journal Articles

Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C

Chu-Hsuan Sha, Pin J. Wang, Wen P. Lin, Chin C. Lee

Publisher: ASME

J. Electron. Packag. December 2011, 133(4): 041007.

https://doi.org/10.1115/1.4005295

Published Online: December 9, 2011

View Article titled, Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C

Topics: Bonding, Diffusion bonding (Metals), Pressure, Silver, Shear (Mechanics), Shear strength, Solders, Atoms, Temperature

Journal Articles

40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding

Chu-Hsuan Sha, Chin C. Lee

Publisher: ASME

J. Electron. Packag. September 2011, 133(3): 031012.

https://doi.org/10.1115/1.4004660

Published Online: September 30, 2011

View Article titled, 40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding

Topics: Bonding, Flip-chip, Silicon chips, Silver, Soldering, Thermal expansion, Pressure, Copper

Journal Articles

Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging

Chu-Hsuan Sha, Chin C. Lee

Publisher: ASME

J. Electron. Packag. June 2011, 133(2): 021005.

https://doi.org/10.1115/1.4003990

Published Online: June 23, 2011

View Article titled, Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging

Topics: Electronic packaging, Stainless steel, Surface finishing, Grain boundaries, Grain size, X-ray diffraction, X-ray analysis

Journal Articles

Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates

Chu-Hsuan Sha, Chin C. Lee

Publisher: ASME

J. Electron. Packag. June 2011, 133(2): 021003.

https://doi.org/10.1115/1.4003868

Published Online: June 22, 2011

View Article titled, Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates

Topics: Bonding, Silicon chips, Pressure, Shear (Mechanics), Silicon, Thermal expansion, Low temperature, Temperature

Journal Articles

Silver Flip-Chip Technology by Solid-State Bonding

Pin J. Wang, Chin C. Lee

Publisher: ASME

J. Electron. Packag. September 2010, 132(3): 035001.

https://doi.org/10.1115/1.4002297

Published Online: September 30, 2010

View Article titled, Silver Flip-Chip Technology by Solid-State Bonding

Topics: Bonding, Flip-chip, Silver, Silicon chips

Journal Articles

Flip-Chip Interconnect for Coplanar Strip Lines

Young K. Song, Chin C. Lee

Publisher: ASME

J. Electron. Packag. December 2008, 130(4): 044501.

https://doi.org/10.1115/1.2993140

Published Online: November 17, 2008

View Article titled, Flip-Chip Interconnect for Coplanar Strip Lines

Topics: Flip-chip, Strips, Circuits, Solders, Signals, Waveguides

Journal Articles

Direct Silver to Copper Bonding Process

Pin J. Wang, Jong S. Kim, Chin C. Lee

Publisher: ASME

J. Electron. Packag. December 2008, 130(4): 045001.

https://doi.org/10.1115/1.2993144

Published Online: November 14, 2008

View Article titled, Direct Silver to Copper Bonding Process

Topics: Bonding, Copper, Silver, Electronic packaging, Thermal expansion, Stress, Scanning electron microscopy

Journal Articles

Advances in Bonding Technology for Electronic Packaging

Chin C. Lee, Chen Y. Wang, Goran Matijasevic

Publisher: ASME

J. Electron. Packag. June 1993, 115(2): 201–207.

https://doi.org/10.1115/1.2909318

Published Online: June 1, 1993

View Article titled, Advances in Bonding Technology for Electronic Packaging

Topics: Bonding, Electronic packaging, Alloys, Temperature, Acoustics, Diffusion (Physics), Melting point, Microscopy, Oxidation, Soldering

Journal citation

NARROW

Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes

40 μ m Copper–Silver Composite Flip-Chip Interconnect Technology Using Solid-State Bonding

Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C

40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding

Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging

Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates

Silver Flip-Chip Technology by Solid-State Bonding

Flip-Chip Interconnect for Coplanar Strip Lines

Direct Silver to Copper Bonding Process

Advances in Bonding Technology for Electronic Packaging

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