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David M. Pierce
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Proceedings Papers

Method for Incorporating Three-Dimensional Residual Stresses Into Patient-Specific Simulations of Arteries

David M. Pierce, Thomas E. Fastl, Hannah Weisbecker, Gerhard A. Holzapfel, Borja Rodriguez-Vila, Enrique J. Gómez, Peter Verbrugghe, Inge Fourneau, Geert Maleux, Paul Herijgers
Proc. ASME. SBC2013, Volume 1B: Extremity; Fluid Mechanics; Gait; Growth, Remodeling, and Repair; Heart Valves; Injury Biomechanics; Mechanotransduction and Sub-Cellular Biophysics; MultiScale Biotransport; Muscle, Tendon and Ligament; Musculoskeletal Devices; Multiscale Mechanics; Thermal Medicine; Ocular Biomechanics; Pediatric Hemodynamics; Pericellular Phenomena; Tissue Mechanics; Biotransport Design and Devices; Spine; Stent Device Hemodynamics; Vascular Solid Mechanics; Student Paper and Design Competitions, V01BT65A001, June 26–29, 2013
Publisher: American Society of Mechanical Engineers
Paper No: SBC2013-14232
https://doi.org/10.1115/SBC2013-14232
View Paper titled, Method for Incorporating Three-Dimensional Residual Stresses Into Patient-Specific Simulations of Arteries
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Topics: Engineering simulation, Residual stresses, Simulation, Biomedical imaging, Aneurysms, Blood, Constitutive equations, Continuum mechanics, Finite element analysis, Geometry
Proceedings Papers

DT-MRI Based Numerical Simulation of Collagen Fiber Deformation in Human Articular Cartilage

David M. Pierce, Werner Trobin, Siegfried Trattnig, Horst Bischof, Gerhard A. Holzapfel
Proc. ASME. SBC2009, ASME 2009 Summer Bioengineering Conference, Parts A and B, 275-276, June 17–21, 2009
Publisher: American Society of Mechanical Engineers
Paper No: SBC2009-203921
https://doi.org/10.1115/SBC2009-203921
View Paper titled, DT-MRI Based Numerical Simulation of Collagen Fiber Deformation in Human Articular Cartilage
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Topics: Cartilage, Computer simulation, Deformation, Fibers, Magnetic resonance imaging, Biological tissues, Bone, Chondrocytes, Density, Electrolytes
Proceedings Papers

Layer-Specific Distributed Collagen Fiber Orientations in Human Arteries, From Thoracic Aorta to Common Iliac

Andreas J. Schriefl, Peter Regitnig, David M. Pierce, Gerhard A. Holzapfel
Proc. ASME. SBC2011, ASME 2011 Summer Bioengineering Conference, Parts A and B, 5-6, June 22–25, 2011
Publisher: American Society of Mechanical Engineers
Paper No: SBC2011-53403
https://doi.org/10.1115/SBC2011-53403
View Paper titled, Layer-Specific Distributed Collagen Fiber Orientations in Human Arteries, From Thoracic Aorta to Common Iliac
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Topics: Aorta, Fibers, Biological tissues, Microscopy
Journal Articles

A Phenomenological Approach Toward Patient-Specific Computational Modeling of Articular Cartilage Including Collagen Fiber Tracking

David M. Pierce, Werner Trobin, Siegfried Trattnig, Horst Bischof, Gerhard A. Holzapfel
Journal: Journal of Biomechanical Engineering
Publisher: ASME
Article Type: Research Papers
J Biomech Eng. September 2009, 131(9): 091006.
https://doi.org/10.1115/1.3148471
Published Online: August 5, 2009
View Article titled, A Phenomenological Approach Toward Patient-Specific Computational Modeling of Articular Cartilage Including Collagen Fiber Tracking
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Topics: Cartilage, Fibers, Simulation, Deformation, Textiles
Journal Articles

A General Methodology to Predict Fatigue Life in Lead-Free Solder Alloy Interconnects

David M. Pierce, Sheri D. Sheppard, Paul T. Vianco
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011008.
https://doi.org/10.1115/1.3068313
Published Online: February 13, 2009
View Article titled, A General Methodology to Predict Fatigue Life in Lead-Free Solder Alloy Interconnects
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Topics: Alloys, Cycles, Dynamic light scattering, Fatigue, Fatigue life, Finite element analysis, Fracture (Materials), Lead-free solders, Simulation, Solders
Journal Articles

Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn–3.9Ag–0.6Cu Lead-Free Solder

David M. Pierce, Sheri D. Sheppard, Arlo F. Fossum, Paul T. Vianco, Mike K. Neilsen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011002.
https://doi.org/10.1115/1.2837513
Published Online: January 31, 2008
View Article titled, Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn–3.9Ag–0.6Cu Lead-Free Solder
Open the PDF for Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn–3.9Ag–0.6Cu Lead-Free Solder in another window
Topics: Constitutive equations, Creep, Damage, Finite element analysis, Plasticity, Simulation, Solders, Temperature, Stress, Fatigue
Journal Articles

Validation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects

David M. Pierce, Sheri D. Sheppard, Paul T. Vianco, Jerome A. Regent, J. Mark Grazier
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011003.
https://doi.org/10.1115/1.2837515
Published Online: January 31, 2008
View Article titled, Validation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects
Open the PDF for Validation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects in another window
Topics: Ball-Grid-Array packaging, Cycles, Fatigue cracks, Fatigue life, Finite element analysis, Fracture (Materials), Manufacturing, Solder joints, Solders, Lead-free solders