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Journal Articles

Inviscid and Viscous Numerical Models Compared to Experimental Data in a Small Data Center Test Cell

Ethan Cruz, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 030904.
Paper No: EP-12-1092
https://doi.org/10.1115/1.4024944
Published Online: July 24, 2013
View Article titled, Inviscid and Viscous Numerical Models Compared to Experimental Data in a Small Data Center Test Cell
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Topics: Computer simulation, Data centers, Flow (Dynamics), Temperature, Tiles, Turbulence, Computational fluid dynamics, Uncertainty
Proceedings Papers

Comparison of Numerical Modeling to Experimental Data in a Small Data Center Test Cell

Ethan Cruz, Yogendra Joshi, Madhusudan Iyengar, Roger Schmidt
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 953-961, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89306
https://doi.org/10.1115/InterPACK2009-89306
View Paper titled, Comparison of Numerical Modeling to Experimental Data in a Small Data Center Test Cell
Open the PDF for Comparison of Numerical Modeling to Experimental Data in a Small Data Center Test Cell in another window
Topics: Computer simulation, Data centers, Computational fluid dynamics, Turbulence, Flow (Dynamics), Temperature, Compacting, Cooling, Design, Heat transfer
Proceedings Papers

Comparison of Numerical Modeling to Experimental Data in a Small, Low Power Data Center Test Cell

Ethan Cruz, Yogendra Joshi, Madhusudan Iyengar, Roger Schmidt
Proc. ASME. IMECE2009, Volume 9: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B and C, 1437-1445, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-12860
https://doi.org/10.1115/IMECE2009-12860
View Paper titled, Comparison of Numerical Modeling to Experimental Data in a Small, Low Power Data Center Test Cell
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Topics: Computer simulation, Data centers, Computational fluid dynamics, Turbulence, Laminar flow, Cooling, Design, Energy dissipation, Flow (Dynamics), Heat transfer
Proceedings Papers

Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures When Adjacent Racks Are Removed

Roger Schmidt, Ethan Cruz
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 481-493, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35240
https://doi.org/10.1115/IPACK2003-35240
View Paper titled, Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures When Adjacent Racks Are Removed
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Topics: Computers, Data centers, Temperature, Computational fluid dynamics, Flow (Dynamics), Tiles, Computer simulation, Design, Electronic equipment, Temperature distribution
Proceedings Papers

Raised Floor Computer Data Center: Effect of Rack Inlet Temperatures When Rack Flowrates Are Reduced

Roger Schmidt, Ethan Cruz
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 495-508, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35241
https://doi.org/10.1115/IPACK2003-35241
View Paper titled, Raised Floor Computer Data Center: Effect of Rack Inlet Temperatures When Rack Flowrates Are Reduced
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Topics: Computers, Data centers, Temperature, Computational fluid dynamics, Flow (Dynamics), Tiles, Computer simulation, Design, Electronic equipment, Exhaust systems
Proceedings Papers

Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures When High Powered Racks are Situated Amongst Lower Powered Racks

Roger Schmidt, Ethan Cruz
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 297-309, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39652
https://doi.org/10.1115/IMECE2002-39652
View Paper titled, Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures When High Powered Racks are Situated Amongst Lower Powered Racks
Open the PDF for Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures When High Powered Racks are Situated Amongst Lower Powered Racks in another window
Topics: Computers, Data centers, Temperature, Computational fluid dynamics, Flow (Dynamics), Tiles, Computer simulation, Design, Electronic equipment, Temperature distribution
Proceedings Papers

Cluster of High Powered Racks Within a Raised Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures

Roger Schmidt, Ethan Cruz
Proc. ASME. IMECE2003, Heat Transfer, Volume 2, 245-262, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42240
https://doi.org/10.1115/IMECE2003-42240
View Paper titled, Cluster of High Powered Racks Within a Raised Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures
Open the PDF for Cluster of High Powered Racks Within a Raised Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures in another window
Topics: Computers, Data centers, Flow (Dynamics), Temperature, Tiles, Computational fluid dynamics, Air flow, Boundary-value problems, Computer simulation, Design
Journal Articles

Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures

Roger Schmidt, Ethan Cruz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 510–518.
https://doi.org/10.1115/1.1827266
Published Online: January 24, 2005
View Article titled, Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures
Open the PDF for Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures in another window
Topics: Data centers, Flow (Dynamics), Temperature, Tiles, Computers