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H. Reichl
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Journal Articles

Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading

B. Wunderle, T. Braun, D. May, B. Michel, H. Reichl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011012.
https://doi.org/10.1115/1.3078187
Published Online: February 13, 2009
View Article titled, Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading
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Topics: Capacitors, Ceramics, Fracture (Materials), Capacitance, Simulation
Journal Articles

A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing

K.-F. Becker, T. Braun, A. Neumann, A. Ostmann, E. Coko, M. Koch, V. Bader, R. Aschenbrenner, H. Reichl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 1–6.
https://doi.org/10.1115/1.1846058
Published Online: March 21, 2005
View Article titled, A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing
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Topics: Lasers, Manufacturing, Packaging, Reliability, Semiconductor wafers, System-in-package, Flip-chip devices, Epoxy adhesives, Epoxy resins
eBook Chapter

Minority Carrier Lifetime Profile Measurements by Use of the Photocurrent Technique

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1980
ISBN-10: 0-8031-0390-5
ISBN: 978-0-8031-0390-0
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