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J. den Toonder
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Proceedings Papers

Dynamics of Elliptic Magnetic Particles in Simple Shear Flow

Tae Gon Kang, Martien A. Hulsen, Jaap M. J. den Toonder
Proc. ASME. AJK2011, ASME-JSME-KSME 2011 Joint Fluids Engineering Conference: Volume 2, Fora, 305-308, July 24–29, 2011
Publisher: American Society of Mechanical Engineers
Paper No: AJK2011-36007
https://doi.org/10.1115/AJK2011-36007
View Paper titled, Dynamics of Elliptic Magnetic Particles in Simple Shear Flow
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Topics: Dynamics (Mechanics), Magnetic particles, Shear flow, Particulate matter, Magnetic fields, Chain, Dimensionless numbers, Equilibrium (Physics), Fluid dynamics, Fluids
Journal Articles

Finite Thickness Influence on Spherical and Conical Indentation on Viscoelastic Thin Polymer Film

V. Gonda, J. den Toonder, J. Beijer, G. Q. Zhang, L. J. Ernst
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 33–37.
https://doi.org/10.1115/1.1846065
Published Online: March 21, 2005
View Article titled, Finite Thickness Influence on Spherical and Conical Indentation on Viscoelastic Thin Polymer Film
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Topics: Polymer films, Thin films, Testing, Creep, Nanoindentation, Stress, Temperature, Viscoelasticity
Journal Articles

Viscoelastic Characterization of Low-Dielectric Constant SiLK Films Using Nanoindentation in Combination With Finite Element Modeling

J. M. J. den Toonder, Y. Ramone, A. R. van Dijken, J. G. J. Beijer, G. Q. Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 276–285.
https://doi.org/10.1115/1.1938990
Published Online: August 12, 2004
View Article titled, Viscoelastic Characterization of Low-Dielectric Constant SiLK Films Using Nanoindentation in Combination With Finite Element Modeling
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Topics: Creep, Finite element analysis, Modeling, Nanoindentation, Stress, Viscoelasticity, Manganese (Metal), Silicon, Relaxation (Physics), Displacement
Journal Articles

Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation

Jaap M. J. den Toonder, Mem. ASME, Christian W. Rademaker, Ching-Li Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 506–511.
https://doi.org/10.1115/1.1604151
Published Online: December 15, 2003
View Article titled, Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation
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Topics: Capacitors, Ceramics, Computation, Computer simulation, Cooling, Finite element analysis, Residual stresses, Simulation, Sintering, Stress