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Journal Articles

Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array

Tong Hong Wang, Yi-Shao Lai, Jenq-Dah Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2004, 126(4): 560–564.
https://doi.org/10.1115/1.1827271
Published Online: January 24, 2005
View Article titled, Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array
Open the PDF for Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array in another window
Topics: Ball-Grid-Array packaging, Creep, Fatigue, Flip-chip, Materials properties, Reliability, Solders, Thermomechanics, Shear (Mechanics), Finite element analysis
Journal Articles

Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test

Ming-Hwa R. Jen, Lee-Cheng Liu, Jenq-Dah Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 446–451.
https://doi.org/10.1115/1.2070090
Published Online: January 13, 2005
View Article titled, Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test
Open the PDF for Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test in another window
Topics: Ball-Grid-Array packaging, Flip-chip, High temperature, Lead-free solders, Reliability, Shear (Mechanics), Failure mechanisms, Solders, Shear strength, Adhesion